Abstract:
The present invention provides: a highly transparent optical member which is formed from a silicone resin or a silicone rubber, and which has less mass change and excellent heat resistance without causing contact faults, or deterioration or contamination of the surface of other members due to adhesion to an electronic circuit or the surfaces of other members; and a production method for producing said optical member. According to the production method, the content of low-molecular-weight siloxanes D3-D20 in a optical member is reduced to an infinitesimal amount with use of a plurality of different low-molecular-weight siloxane removal steps.
Abstract:
A lens for light emitting lamps that use light emitting elements such as LEDs, etc., is provided. The lens has a specific surface shape for light-distribution control to achieve desired light distributions, as well as a light emitting device using said lens. On the lens surface of the light emitting side which has a double-peak shape to obtain a light distribution characteristic having long and short two axes, by possessing a straight-line part in the surface shape of the light emitting side viewed on the lens short-axis cross section, a desired smoothly-diffused light distribution having a longitudinal direction with a certain width is obtained. The lens may be designed to have a surface of the light emitting side comprising a collection of straight lines parallel to the lens short-axis cross section, or to have a continuous curved surface comprising a collection of straight lines parallel to the lens short axis.
Abstract:
A lens-equipped optical semiconductor device including: an optical semiconductor device including at least one optical semiconductor element mounted on a substrate and a transparent resin encapsulating body that encapsulates the optical semiconductor element; a resin lens having a recessed portion for housing the transparent resin encapsulating body; and a transparent resin layer filled into a space among the substrate, the recessed portion, and the transparent resin encapsulating body, wherein the recessed portion has a capacity that is at least 1.1 times a total volume of the optical semiconductor element and the transparent resin encapsulating body.