公开(公告)号：US11643552B2

公开(公告)日：2023-05-09

申请号：US17307020

申请日：2021-05-04

Applicant: ASCEND PERFORMANCE MATERIALS OPERATIONS LLC

Inventor： Jacob G. Ray ,  Ramesh Ramakrishnan ,  Douglas Claire Hoffman ,  Roland M. Planeta

IPC: C08L77/06 ,  C08J5/18

CPC classification number: C08L77/06 ,  C08J5/18 ,  C08J2377/06 ,  C08J2477/06 ,  C08L2205/025

Abstract: Provided herein are polymer films including a polyamide composition of PA6 and PA66/6. The provided films are particularly useful as packaging materials as they exhibit improved toughness, e.g., puncture and impact resistance, relative to that of conventional films that include only PA6 as a polyamide component. Also provided are methods for making the provided films, and articles that include the provided films.

公开(公告)号：US20210347993A1

公开(公告)日：2021-11-11

申请号：US17307020

申请日：2021-05-04

Applicant: ASCEND PERFORMANCE MATERIALS OPERATIONS LLC

Inventor： Jacob G. Ray ,  Ramesh Ramakrishnan ,  Douglas Claire Hoffman ,  Roland M. Planeta

IPC: C08L77/06 ,  C08J5/18

Abstract: Provided herein are polymer films including a polyamide composition of PA6 and PA66/6. The provided films are particularly useful as packaging materials as they exhibit improved toughness, e.g., puncture and impact resistance, relative to that of conventional films that include only PA6 as a polyamide component. Also provided are methods for making the provided films, and articles that include the provided films.