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公开(公告)号:US20220229372A1
公开(公告)日:2022-07-21
申请号:US17608505
申请日:2020-04-03
Applicant: ASML NETHERLANDS B.V.
Inventor: Patrick Willem Paul LIMPENS , Gerard Johannes BOOGAARD , Michaël Johannes Anna Maria WALTERS
Abstract: An actuator, configured to move a first object with respect to a second object, that includes a first body having an annular ring, a second body, arranged movably with respect to the first body, having a longitudinal shaft at least partially disposed within the annular ring, and at least one spring device, arranged between the first body and the second body, wherein the at least one spring device is configured to guide relative movements between the first body and the second body in a range of movement, and the at least one spring device has two or more leaf springs, wherein each of the two or more leaf springs is connected to the first body and to the second body, and wherein at least one of the leaf springs is in a non-planar state when the spring device is in an equilibrium position.
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公开(公告)号:US20190227445A1
公开(公告)日:2019-07-25
申请号:US16326948
申请日:2017-08-11
Applicant: ASML Netherlands B.V.
Inventor: Frits VAN DER MEULEN , Erik Johan ARLEMARK , Hendrikus Herman Marie COX , Martinus Agnes Willem CUIJPERS , Joost DE HOOGH , Gosse Charles DE VRIES , Paul Comé Henri DE WIT , Sander Catharina Reinier DERKS , Ronald Comelis Gerardus GIJZEN , Dries Vaast Paul HEMSCHOOTE , Christiaan Alexander HOOGENDAM , Adrianus Hendrik KOEVOETS , Raymond Wilhelmus Louis LAFARRE , Alain Louis Claude LEROUX , Patrick Willem Paul LIMPENS , Jim Vincent OVERKAMP , Christiaan Louis VALENTIN , Koos VAN BERKEL , Stan Henricus VAN DER MEULEN , Jacobus Comelis Gerardus VAN DER SANDEN , Harmen Klaas VAN DER SCHOOT , David Ferdinand VLES , Evert Auke Rinze WESTERHUIS
IPC: G03F7/20
Abstract: A lithographic apparatus comprising a projection system configured to project a patterned radiation beam to form an exposure area on a substrate held on a substrate table, the lithographic apparatus further comprising a cooling apparatus for cooling the substrate, wherein the cooling apparatus comprises a cooling element located above the substrate table and adjacent to the exposure area, the cooling element being configured to remove heat from the substrate.
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