公开(公告)号：US20190278188A1

公开(公告)日：2019-09-12

申请号：US16351873

申请日：2019-03-13

Applicant: ASML Netherlands B.V.

Inventor： Alexander YPMA ,  Jasper MENGER ,  David DECKERS ,  David HAN ,  Adrianus Cornelis Matheus KOOPMAN ,  Irina LYULINA ,  Scott Anderson MIDDLEBROOKS ,  Richard Johannes Franciscus VAN HAREN ,  Jochem Sebastiaan WILDENBERG

IPC: G03F7/20 ,  G06F16/26 ,  G03F9/00

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

公开(公告)号：US20220326623A1

公开(公告)日：2022-10-13

申请号：US17836099

申请日：2022-06-09

Applicant: ASML Netherlands B.V.

Inventor： Alexander YPMA ,  Jasper MENGER ,  David DECKERS ,  David HAN ,  Adrianus Cornelis Matheus KOOPMAN ,  Irina LYULINA ,  Scott Anderson MIDDLEBROOKS ,  Richard Johannes Franciscus VAN HAREN ,  Jochem Sebastiaan WILDENBERG

IPC: G03F7/20

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

公开(公告)号：US20200264520A1

公开(公告)日：2020-08-20

申请号：US16864456

申请日：2020-05-01

Applicant: ASML Netherlands B.V.

Inventor： Alexander YPMA ,  Jasper MENGER ,  David DECKERS ,  David HAN ,  Adrianus Cornelis Matheus KOOPMAN ,  Irina LYULINA ,  Scott Anderson MIDDLEBROOKS ,  Richard Johannes Franciscu VAN HAREN ,  Jochem Sebastiaan WILDENBERG

IPC: G03F7/20 ,  G03F9/00 ,  G06F16/26

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

公开(公告)号：US20150153656A1

公开(公告)日：2015-06-04

申请号：US14613687

申请日：2015-02-04

Applicant: ASML Netherlands B.V.

Inventor： Stefan Cornelis Theodorus VAN DER SANDEN ,  Richard Johanne Franciscus VAN HAREN ,  Hubertus Johannes Gertrudus SIMONS ,  Remi Daniel Marie EDART ,  Xiuhong WEI ,  Irina LYULINA ,  Michael KUBIS

IPC: G03F7/20

CPC classification number: G03F7/70616 ,  G03F7/70141 ,  G03F7/70633 ,  G03F9/7003 ,  G03F9/7088

Abstract: A substrate is loaded onto a substrate support of a lithographic apparatus, after which the apparatus measures locations of substrate alignment marks. These measurements define first correction information allowing the apparatus to apply a pattern at one or more desired locations on the substrate. Additional second correction information is used to enhance accuracy of pattern positioning, in particular to correct higher order distortions of a nominal alignment grid. The second correction information may be based on measurements of locations of alignment marks made when applying a previous pattern to the same substrate. The second correction information may alternatively or in addition be based on measurements made on similar substrates that have been patterned prior to the current substrate.

Abstract translation: 衬底被加载到光刻设备的衬底支撑件上，之后设备测量衬底对准标记的位置。 这些测量定义了第一校正信息，允许设备在衬底上的一个或多个所需位置上施加图案。 附加的第二校正信息用于增强图案定位的精度，特别是校正标称对准格栅的较高阶失真。 第二校正信息可以基于当对同一衬底施加先前图案时制作的对准标记的位置的测量。 第二校正信息可以替代地或另外基于在当前衬底之前已被图案化的类似衬底上进行的测量。