公开(公告)号：US20140233257A1

公开(公告)日：2014-08-21

申请号：US14045805

申请日：2013-10-04

Applicant: AU Optronics Corp.

Inventor： Chieh-Jen Cheng

IPC: F21V23/00 ,  F21V8/00

CPC classification number: F21V23/001 ,  F21V23/006 ,  F21Y2115/10 ,  G02B6/0083

Abstract: A light emitting module includes a first circuit board, a driver chip, two connectors, a second circuit board and a plurality of light emitting units. The driver chip is disposed on the first circuit board. The two connectors are disposed on the first circuit board and electrically connected to the driver chip. The second circuit board has two groups of connecting cables and each group of connecting cables is electrically connected to one of the two connectors. The light emitting units are disposed on the second circuit board and electrically connected to the two groups of connecting cables.

Abstract translation: 发光模块包括第一电路板，驱动芯片，两个连接器，第二电路板和多个发光单元。 驱动器芯片设置在第一电路板上。 两个连接器设置在第一电路板上并电连接到驱动器芯片。 第二个电路板有两组连接电缆，每组连接电缆电连接到两个连接器之一。 发光单元设置在第二电路板上并电连接到两组连接电缆。

公开(公告)号：US20130299869A1

公开(公告)日：2013-11-14

申请号：US13945905

申请日：2013-07-19

Applicant: AU Optronics Corp.

Inventor： Chieh-Jen Cheng ,  Chia-Hun Cheng

IPC: H01L33/62

CPC classification number: H01L33/62 ,  G02F1/133603 ,  G02F2001/133612 ,  H01L33/486 ,  H01L2924/0002 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: A light-emitting module includes a light-emitting diode package structure and an insulating support structure. The light-emitting diode package structure includes a package base and at least two leads. The package base has a first surface, and each lead has a bonding surface. The insulating support structure has a second surface and a third surface opposite to each other, and the insulating support structure is disposed under the package base, so that the first surface is in contact with the second surface. The bonding surfaces and the third surface are located in different planes.

Abstract translation: 发光模块包括发光二极管封装结构和绝缘支撑结构。 发光二极管封装结构包括封装基座和至少两个引线。 封装基座具有第一表面，并且每个引线具有接合表面。 绝缘支撑结构具有彼此相对的第二表面和第三表面，并且绝缘支撑结构设置在封装基底下方，使得第一表面与第二表面接触。 接合表面和第三表面位于不同的平面中。