公开(公告)号：US20180294549A1

公开(公告)日：2018-10-11

申请号：US15484899

申请日：2017-04-11

Applicant: AUDEN TECHNO CORP.

Inventor： CHIA-LUN TANG ,  CHI-MING CHIANG ,  CHUN-CHUAN CHANG ,  TZU-HSIANG CHIEN

IPC: H01Q1/24 ,  H01Q1/48 ,  H01Q5/328

CPC classification number: H01Q1/245 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q5/328 ,  H01Q9/42

Abstract: A radiofrequency antenna device includes a carrier, an antenna structure, a high-frequency blocking unit, and a proximity sensor (P-sensor), which are disposed on the carrier. The antenna structure includes a supporting frame disposed on the carrier, a first coupling segment disposed on the supporting frame, a second coupling segment disposed on the carrier, an insulating adhesive layer connected between the first and the second coupling segments, a radiating body disposed on the supporting frame and connected to the first coupling segment, and a feeding conductor disposed on the supporting frame. The feeding conductor is configured to transmit a signal to the radiating body. The high-frequency blocking unit is electrically connected to the first coupling segment. The P-sensor is electrically connected to the high-frequency blocking unit, and the P-sensor is electrically connected to the first coupling segment and the radiating body through the high-frequency blocking unit.

公开(公告)号：US20160006125A1

公开(公告)日：2016-01-07

申请号：US14321898

申请日：2014-07-02

Applicant: AUDEN TECHNO CORP.

Inventor： SHIH-CHI LAI ,  TZU-HSIANG CHIEN ,  CHENG-MIN YANG

IPC: H01Q9/04 ,  H01Q1/48

CPC classification number: G06K7/10891 ,  G06K7/10396 ,  G06K7/10554 ,  G06K7/10722 ,  G06K7/1091 ,  G06K7/1443 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01Q1/2283 ,  H01Q1/52 ,  H01Q9/045 ,  H01Q9/42

Abstract: A chip structure for mounting on a clearance area of a printed circuit board includes a packaged chip and a monopole coupling antenna. The packaged chip has an insulating body, an electronic component embedded in the insulating body, and a plurality of grounding pads electrically connected to the electronic component. The monopole coupling antenna has a grounding radiating metal and a monopole radiating metal. The packaged chip is electrically connected to the grounding radiating metal by the grounding pads. The monopole radiating metal is disposed on the insulating body and spaced apart from the electronic component and the grounding radiating metal. The monopole radiating metal is configured to couple the grounding radiating metal and the electronic component by using a feeding circuit to connect the packaged chip and the monopole radiating metal and using a grounding circuit to connect the grounding radiating metal and the printed circuit board.

Abstract translation: 用于安装在印刷电路板的间隙区域上的芯片结构包括封装芯片和单极耦合天线。 封装的芯片具有绝缘体，嵌入在绝缘体中的电子部件，以及与电子部件电连接的多个接地焊盘。 单极耦合天线具有接地辐射金属和​​单极辐射金属。 封装的芯片通过接地焊盘电连接到接地辐射金属。 单极辐射金属设置在绝缘体上并与电子部件和接地辐射金属间隔开。 单极辐射金属被配置为通过使用馈电电路来连接接地辐射金属和​​电子部件，以连接封装芯片和单极辐射金属，并且使用接地电路来连接接地辐射金属和​​印刷电路板。