公开(公告)号：US20190338783A1

公开(公告)日：2019-11-07

申请号：US16011693

申请日：2018-06-19

Applicant: AURAS Technology Co., Ltd.

Inventor： Mu-Shu Fan ,  Che-Chia Chang ,  Chien-Yu Chen

IPC: F04D29/38 ,  F28D1/047 ,  F28D1/02 ,  H05K7/20 ,  F04D25/06 ,  F04D29/058 ,  F04D29/054

Abstract: A dual-impeller driving device and a liquid-cooling heat dissipation device with the dual-impeller driving device are provided. The dual-impeller driving device includes a double-sided circuit board, a first stator, a first magnetic element, a first impeller, a second stator, a second magnetic element, a second impeller and a shaft. The first stator is located beside a first active surface of the double-sided circuit board. The first magnetic element is located near the first stator. The first impeller is combined with the first magnetic element. The second stator is located beside a second active surface of the double-sided circuit board. The second magnetic element is located near the second stator. The second impeller is combined with the second magnetic element. The shaft is penetrated through the double-sided circuit board. The first impeller and the second impeller are rotated about the shaft.

公开(公告)号：US20170347488A1

公开(公告)日：2017-11-30

申请号：US15210093

申请日：2016-07-14

Applicant: AURAS Technology Co., Ltd.

Inventor： An-Chih Wu ,  Che-Chia Chang

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H01L23/40 ,  H01L23/427 ,  H01L23/467 ,  H05K7/20136 ,  H05K7/2039

Abstract: A heat dissipating device with stacked heat pipes is provided. Two layers of flat-type heat pipes are employed. A thermal pad and a fin group include convex structures and concave structures. The shapes of the convex structures and concave structures are complementary to the flat-type heat pipes. Consequently, the heat dissipating efficiency of the heat dissipating device is enhanced.

公开(公告)号：US10785892B1

公开(公告)日：2020-09-22

申请号：US16516309

申请日：2019-07-19

Applicant: AURAS Technology Co., Ltd.

Inventor： Chien-An Chen ,  Chien-Yu Chen ,  Mu-Shu Fan ,  Shih-Chieh Kao ,  Che-Chia Chang

IPC: H05K7/20 ,  G06F1/20

Abstract: A heat dissipation system and a coolant distribution module for plural electronic components of an electronic computing device are provided. The heat dissipation system includes plural water-cooling heads, a heat dissipation device and the coolant distribution module. When a fluid medium flows through the heat dissipation device, the heat dissipation device exchanges heat with the fluid medium. The coolant distribution module is connected between the plural water-cooling heads and the heat dissipation device. The coolant distribution module includes a main body and a power module. The module main body includes a cooled fluid chamber. The cooled fluid chamber includes plural first outlets corresponding to the plural water-cooling heads. The power module is installed in the module main body. The power module drives the fluid medium to be outputted from the plural first outlets. Consequently, the fluid medium is transferred through a circulating loop.

公开(公告)号：USD848962S1

公开(公告)日：2019-05-21

申请号：US29647821

申请日：2018-05-16

Applicant: AURAS Technology Co., Ltd.

Designer： Mu-Shu Fan ,  Che-Chia Chang ,  Wan-Chi Hsiao ,  Yu-Ting Chang

公开(公告)号：USD848960S1

公开(公告)日：2019-05-21

申请号：US29634391

申请日：2018-01-22

Applicant: AURAS Technology Co., Ltd.

Designer： Mu-Shu Fan ,  Che-Chia Chang ,  Yi-Wun Chen

公开(公告)号：USD896190S1

公开(公告)日：2020-09-15

申请号：US29675514

申请日：2019-01-03

Applicant: AURAS Technology Co., Ltd.

Designer： Mu-Shu Fan ,  Che-Chia Chang ,  Yu-Ting Chang

公开(公告)号：USD848961S1

公开(公告)日：2019-05-21

申请号：US29636557

申请日：2018-02-09

Applicant: AURAS Technology Co., Ltd.

Designer： Mu-Shu Fan ,  Che-Chia Chang ,  Yi-Wun Chen ,  Yu-Ting Chang ,  Wan-Chi Hsiao