公开(公告)号：US20150301026A1

公开(公告)日：2015-10-22

申请号：US14744513

申请日：2015-06-19

Applicant: AXION BIOSYSTEMS, INC.

Inventor： Swaminathan Rajaraman ,  James D Ross ,  Amanda Preyer

IPC: G01N33/50

CPC classification number: G01N33/5014 ,  B01L3/5085 ,  B01L2200/025 ,  B01L2300/0645 ,  B01L2300/0829 ,  C12M23/12 ,  G01N33/4836

Abstract: Electrophysiology culture plates are provided and are formed from a transparent micro-electrode array (MEA) plate. The MEA plate comprises a substrate, a first layer and a first insulating layer. The substrate has a plurality of vias extending from an upper to a lower surface, each via being in electrical contact with each of a plurality of contact pads disposed on the lower surface. The first layer is disposed on the upper surface of the substrate and has a plurality of MEA arrays in in electrical communication with at least a first routing layer. Each MEA array comprises a plurality of reference electrodes and a plurality of microelectrodes and the first routing layer is in electrical communication with a select number of the plurality of vias. A first insulating layer is disposed on the first layer. The MEA plate is joined to a biologic culture plate having a plurality of culture wells such that each culture well defines an interior cavity having a bottom surface that is at least partially transparent and in positioned in registration with a select optical port. The MEA plate is coupled to the biologic culture well plate such that each MEA array is operatively coupled to one culture well wherein each microelectrode and each reference electrode are in electrical communication with the interior cavity through the bottom surface of the culture well.

Abstract translation: 提供电生理培养板并由透明微电极阵列（MEA）板形成。 MEA板包括基底，第一层和第一绝缘层。 衬底具有从上表面延伸到下表面的多个通孔，每个通孔与设置在下表面上的多个接触焊盘中的每一个电接触。 第一层设置在衬底的上表面上并且具有与至少第一路由层电通信的多个MEA阵列。 每个MEA阵列包括多个参考电极和多个微电极，并且第一路由层与选择数量的多个通孔电连通。 第一绝缘层设置在第一层上。 将MEA板连接到具有多个培养孔的生物培养板，使得每个培养井定义具有至少部分透明的底表面并定位成与选择光学端口对准的内部空腔。 将MEA板耦合到生物培养孔板，使得每个MEA阵列可操作地偶联到一个培养孔，其中每个微电极和每个参比电极通过培养孔的底表面与内腔电连通。

公开(公告)号：US09329168B2

公开(公告)日：2016-05-03

申请号：US14744513

申请日：2015-06-19

Applicant: AXION BIOSYSTEMS, INC.

Inventor： Swaminathan Rajaraman ,  James D Ross ,  Amanda Preyer

IPC: G01N27/327 ,  G01N33/50 ,  G01N33/483

CPC classification number: G01N33/5014 ,  B01L3/5085 ,  B01L2200/025 ,  B01L2300/0645 ,  B01L2300/0829 ,  C12M23/12 ,  G01N33/4836

Abstract: Electrophysiology culture plates are provided and are formed from a transparent microelectrode array (MEA) plate. The MEA plate comprises a substrate, a first layer and a first insulating layer. The substrate has a plurality of vias extending from an upper to a lower surface, each via being in electrical contact with each of a plurality of contact pads disposed on the lower surface. The first layer is disposed on the upper surface of the substrate and has a plurality of MEA arrays in electrical communication with at least a first routing layer. Each MEA array comprises a plurality of reference electrodes and a plurality of microelectrodes and the first routing layer is in electrical communication with a select number of the plurality of vias. A first insulating layer is disposed on the first layer. The MEA plate is joined to a biologic culture plate having a plurality of culture wells such that each culture well defines an interior cavity having a bottom surface that is at least partially transparent and in positioned in registration with a select optical port. The MEA plate is coupled to the biologic culture well plate such that each MEA array is operatively coupled to one culture well wherein each microelectrode and each reference electrode are in electrical communication with the interior cavity through the bottom surface of the culture well.

Abstract translation: 提供电生理培养板并由透明微电极阵列（MEA）板形成。 MEA板包括基底，第一层和第一绝缘层。 衬底具有从上表面延伸到下表面的多个通孔，每个通孔与设置在下表面上的多个接触焊盘中的每一个电接触。 第一层设置在衬底的上表面上并且具有与至少第一路由层电连通的多个MEA阵列。 每个MEA阵列包括多个参考电极和多个微电极，并且第一路由层与选择数量的多个通孔电连通。 第一绝缘层设置在第一层上。 将MEA板连接到具有多个培养孔的生物培养板，使得每个培养井定义具有至少部分透明的底表面并定位成与选择光学端口对准的内部空腔。 将MEA板耦合到生物培养孔板，使得每个MEA阵列可操作地偶联到一个培养孔，其中每个微电极和每个参比电极通过培养孔的底表面与内腔电连通。