公开(公告)号：US20240120288A1

公开(公告)日：2024-04-11

申请号：US17962354

申请日：2022-10-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Hsin LAI ,  Chih-Cheng LEE ,  Shao-Lun YANG ,  Wei-Chih CHO

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/3025

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate, an encapsulant and an electronic component. The encapsulant is disposed over the substrate, and has a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface. A roughness of the first lateral surface is less than or equal to a roughness of the second top surface. The electronic component is disposed over the second top surface of the encapsulant and electrically connected to the substrate.