公开(公告)号：US20220068868A1

公开(公告)日：2022-03-03

申请号：US17521786

申请日：2021-11-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： An-Nong WEN ,  Ching-Han HUANG ,  Ching-Ho CHANG

IPC: H01L23/00 ,  B81B7/00 ,  B81C3/00

Abstract: A semiconductor package includes a first die having a first surface, a first conductive bump over the first surface and having first height and a first width, a second conductive bump over the first surface and having a second height and a second width. The first width is greater than the second width and the first height is substantially identical to the second height. A method for manufacturing the semiconductor package is also provided.