公开(公告)号：US11232998B2

公开(公告)日：2022-01-25

申请号：US16732054

申请日：2019-12-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Fong Jhong ,  Chen-Chao Wang ,  Hung-Chun Kuo

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/522 ,  H01L21/48 ,  H01L23/528 ,  H01L23/498

Abstract: A semiconductor device package includes a substrate, a first circuit layer and a second circuit layer. The first circuit layer is disposed on the substrate. The first circuit layer has a plurality of dielectric layers and a first through via penetrating the dielectric layers and electrically connected to the substrate. The second circuit layer is disposed on the first circuit layer. The second circuit layer has a plurality of dielectric layers and a second through via penetrating the dielectric layers and electrically connected to the first circuit layer.

公开(公告)号：US11990385B2

公开(公告)日：2024-05-21

申请号：US17681694

申请日：2022-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Chieh Hung ,  Hung-Chun Kuo

IPC: H01L23/367 ,  H01L23/48 ,  H01L23/50 ,  H01L23/538 ,  H01L25/18 ,  H01L23/00

CPC classification number: H01L23/3677 ,  H01L23/481 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/18 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/17181

Abstract: An electronic device is provided. The electronic device includes an electronic component and a heat dissipation structure. The electronic component has a passive surface and a plurality of conductive vias exposed from the passive surface. The heat dissipation structure is disposed on the passive surface and configured to transmit a plurality of independent powers to the conductive vias through the passive surface.

公开(公告)号：US11991827B2

公开(公告)日：2024-05-21

申请号：US17966701

申请日：2022-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Yen Ting ,  Pao-Nan Lee ,  Hung-Chun Kuo ,  Jung Jui Kang ,  Chang Chi Lee

IPC: H05K1/14

CPC classification number: H05K1/141

Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.

公开(公告)号：US11328999B2

公开(公告)日：2022-05-10

申请号：US16706533

申请日：2019-12-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Fu-Chen Chu ,  Hung-Chun Kuo ,  Chen-Chao Wang

IPC: H01L23/538 ,  H01L23/552 ,  H01L23/00

Abstract: A semiconductor device package includes a lower-density substrate and a higher-density substrate. The higher-density substrate is attached to the lower-density substrate. The higher-density substrate has a first interconnection layer and a second interconnection layer disposed over the first interconnection layer. A thickness of the first interconnection layer is different from a thickness of the second interconnection layer.

公开(公告)号：US12156336B2

公开(公告)日：2024-11-26

申请号：US17856898

申请日：2022-07-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying Kuo ,  Hung-Chun Kuo ,  Pao-Nan Lee ,  Jung Jui Kang ,  Chang Chi Lee

IPC: H05K1/18 ,  H05K1/02

Abstract: An electronic device is disclosed. The electronic device includes a carrier including a first portion, a second portion over the first portion, and a third portion connecting the first portion and the second portion. The electronic device also includes a first electronic component disposed between the first portion and the second portion. An active surface of the first electronic component faces the second portion. The electronic device also includes a second electronic component disposed over the second portion. The first portion is configured to transmit a first power signal to a backside surface of the first electronic component opposite to the active surface.

公开(公告)号：US10014268B2

公开(公告)日：2018-07-03

申请号：US15057673

申请日：2016-03-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Jun Zhuang ,  Hung-Chun Kuo ,  Chun-Chin Huang

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L23/5386 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/03472 ,  H01L2224/06051 ,  H01L2224/06152 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14134 ,  H01L2224/14136 ,  H01L2224/14151 ,  H01L2224/14156 ,  H01L2224/17106 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81447 ,  H01L2924/15321 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor device includes a substrate main body, a plurality of first bump pads, and redistribution layer (RDL). The first bump pads are disposed adjacent to a surface of the substrate main body, each of the first bump pads has a first profile from a top view, the first profile has a first width along a first direction and a second width along a second direction perpendicular to the first direction, and the first width of the first profile is greater than the second width of the first profile. The RDL is disposed adjacent to the surface of the substrate main body, and the RDL includes a first portion disposed between two first bump pads.

公开(公告)号：US12211780B2

公开(公告)日：2025-01-28

申请号：US17569447

申请日：2022-01-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying Kuo ,  Hung-Chun Kuo

IPC: H01L23/498 ,  G02B6/12 ,  H01L23/31

Abstract: An electronic package structure is provided. The electronic package structure includes a first carrier, a first electronic component, a first optical channel, and a second electronic component. The first electronic component is disposed on or within the first carrier. The first optical channel is disposed within the first carrier. The first optical channel is configured to provide optical communication between the first electronic component and the second electronic component. The first carrier is configured to electrically connect the first electronic component.

公开(公告)号：US12131972B2

公开(公告)日：2024-10-29

申请号：US17681695

申请日：2022-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-Chih Pan ,  Hung-Chun Kuo

IPC: H01L23/367 ,  H01L23/495 ,  H01L23/538 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/367 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/5384 ,  H01L25/0657 ,  H01L25/18

Abstract: An electronic device is disclosed. The electronic device includes an active component, a power regulating component disposed on the active component, and a patterned conductive element disposed between the active component and the power regulating component. The patterned conductive element is configured to provide one or more heat dissipation paths for the active component and to provide a power path between the active component and the power regulating component.

公开(公告)号：US11973018B2

公开(公告)日：2024-04-30

申请号：US17668237

申请日：2022-02-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying Kuo ,  Hung-Chun Kuo

IPC: H01L23/50 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/50 ,  H01L23/3107 ,  H01L23/49816

Abstract: An electronic package is provided. The electronic package includes a power regulating component, an electronic component, and a circuit structure. The circuit structure separates the power regulating component and the electronic component. The circuit structure is configured to provide a first power to the power regulating component. The power regulating component is configured to provide a second power to the electronic component through the circuit structure.