公开(公告)号：US20230253302A1

公开(公告)日：2023-08-10

申请号：US17669231

申请日：2022-02-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pao-Nan LEE ,  Chen-Chao WANG ,  Chang Chi LEE

IPC: H01L23/498 ,  H01L25/16

CPC classification number: H01L23/49838 ,  H01L25/16

Abstract: An electronic package is disclosed. The electronic package includes an electronic component and a plurality of power regulating components. The plurality of power regulating components includes a first power regulating component and a second power regulating component. A first power path is established from the first power regulating component to a backside surface of the electronic component. A second power path is established from the second power regulating component to the backside surface of the electronic component.

公开(公告)号：US20170200702A1

公开(公告)日：2017-07-13

申请号：US15404093

申请日：2017-01-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Pin HUNG ,  Ying-Te OU ,  Pao-Nan LEE

IPC: H01L25/065 ,  H01L23/528 ,  H01L23/31 ,  H01L23/522

CPC classification number: H01L25/0657 ,  H01L23/3121 ,  H01L23/5226 ,  H01L23/528 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: In one or more embodiments, a semiconductor device includes a substrate, a first dielectric layer and a first conductive layer. The substrate includes a first surface and a second surface opposite the first surface. The first dielectric layer is on the first surface of the substrate. The first conductive layer is on the first surface of the substrate and includes a first portion on the first dielectric layer and a second portion surrounded by the first dielectric layer. The second portion of the first conductive layer extends from the first portion of the first conductive layer through the first dielectric layer to contact the first surface of the substrate.

公开(公告)号：US20240130043A1

公开(公告)日：2024-04-18

申请号：US17966701

申请日：2022-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Yen TING ,  Pao-Nan LEE ,  Hung-Chun KUO ,  Jung Jui KANG ,  Chang Chi LEE

IPC: H05K1/14

CPC classification number: H05K1/141

Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.

公开(公告)号：US20240030135A1

公开(公告)日：2024-01-25

申请号：US17870674

申请日：2022-07-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pao-Nan LEE ,  Jung Jui KANG ,  Chang Chi LEE

IPC: H01L23/528 ,  H01L23/48 ,  H01L23/522 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/5286 ,  H01L23/481 ,  H01L23/5226 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/48091 ,  H01L2224/48248 ,  H01L2224/73265 ,  H01L2224/16227

Abstract: An electronic device is disclosed. The electronic device includes a carrier including a first region and a second region distinct from the first region. The electronic device also includes an electronic component covering the first region and at least partially exposing the second region. The electronic device also includes a first power regulating element in the second region of the carrier and a second power regulating element. The second power regulating element is disposed adjacent to the first power regulating element and electrically connected to the electronic component through the first power regulating element to provide a first power path.

公开(公告)号：US20240008184A1

公开(公告)日：2024-01-04

申请号：US17856898

申请日：2022-07-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chiung-Ying KUO ,  Hung-Chun KUO ,  Pao-Nan LEE ,  Jung Jui KANG ,  Chang Chi LEE

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/181 ,  H05K1/0216 ,  H05K1/028

Abstract: An electronic device is disclosed. The electronic device includes a carrier including a first portion, a second portion over the first portion, and a third portion connecting the first portion and the second portion. The electronic device also includes a first electronic component disposed between the first portion and the second portion. An active surface of the first electronic component faces the second portion. The electronic device also includes a second electronic component disposed over the second portion. The first portion is configured to transmit a first power signal to a backside surface of the first electronic component opposite to the active surface.

公开(公告)号：US20240429213A1

公开(公告)日：2024-12-26

申请号：US18212155

申请日：2023-06-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Syu-Tang LIU ,  Pao-Nan LEE ,  Yu-Hsun CHANG ,  Jung Jui KANG

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/64

Abstract: An electronic device is provided. The electronic device includes a package structure and a power regulating element. The package structure includes an electronic component, a plurality of first conductive structures, and an encapsulant. The plurality of first conductive structures are connected to the electronic component. The encapsulant encapsulates the electronic component and exposes a portion of the plurality of first conductive structures. The power regulating component includes a plurality of second conductive structures directly bonded with the plurality of first conductive structures and configured to provide the electronic component with a power signal.

公开(公告)号：US20240055365A1

公开(公告)日：2024-02-15

申请号：US17886254

申请日：2022-08-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-I WU ,  Jung Jui KANG ,  Chang Chi LEE ,  Pao-Nan LEE ,  Ming-Fong JHONG

IPC: H01L23/552 ,  H01L23/48 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/481 ,  H01L23/66 ,  H01L2223/6616

Abstract: An electronic device is disclosed. The electronic device includes a first interconnection structure, and a first electronic component disposed over the first interconnection structure and having an active surface and a lateral surface. The electronic device also includes a power connection disposed between the first interconnection structure and the active surface of the first electronic component, and a first non-power connection extending along the lateral surface of the first electronic component and electrically connected to the first interconnection structure. The electronic device also includes a second non-power connection disposed between the first interconnection structure and the active surface of the first electronic component. The second non-power connection is configured to block an electromagnetic interference (EMI) between the power connection and the first non-power connection.

公开(公告)号：US20230215810A1

公开(公告)日：2023-07-06

申请号：US17566579

申请日：2021-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pao-Nan LEE ,  Chen-Chao WANG ,  Chang Chi LEE

IPC: H01L23/552 ,  H01L23/31 ,  H01L49/02 ,  H01L25/16

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L28/10 ,  H01L28/40 ,  H01L25/16

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.

公开(公告)号：US20250054877A1

公开(公告)日：2025-02-13

申请号：US18931026

申请日：2024-10-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pao-Nan LEE ,  Chen-Chao WANG ,  Chang Chi LEE

IPC: H01L23/552 ,  H01L23/31 ,  H01L25/16

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an electronic component, and an inductance component. The protection layer encapsulates the electronic component and has a top surface and a bottom surface. The top surface and the bottom surface collectively define a space to accommodate the electronic component. The inductance component outflanks the space from the top surface and the bottom surface of the protection layer.

公开(公告)号：US20240421086A1

公开(公告)日：2024-12-19

申请号：US18211222

申请日：2023-06-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pao-Nan LEE ,  Syu-Tang LIU ,  Yu-Hsun CHANG

IPC: H01L23/528 ,  H01L25/065

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component, a second electronic component, and a circuit structure. The circuit structure is supported by the first electronic component and the second electronic component. The circuit structure electrically connects the first electronic component to the second electronic component and is configured to provide the first electronic component and the second electronic component with a power.