公开(公告)号：US11923285B2

公开(公告)日：2024-03-05

申请号：US17142198

申请日：2021-01-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-Jen Cheng ,  Chien-Fan Chen

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/18

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L25/18 ,  H01L23/3135 ,  H01L2224/16227

Abstract: An electronic device package and a method for manufacturing the same are provided. The electronic device package includes a circuit layer and an electronic component. The circuit layer includes a dielectric layer having an opening, and an electrical contact. A width of an aperture of the opening increases from a first surface toward a second surface. The electrical contact is at least partially disposed in the opening and exposed through the opening. The electronic component is disposed on the second surface and electrically connected to the circuit layer.

公开(公告)号：US11961808B2

公开(公告)日：2024-04-16

申请号：US17501953

申请日：2021-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Jen Wang ,  Po-Jen Cheng ,  Fu-Yuan Chen ,  Yi-Hsin Cheng

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L23/562 ,  H01L23/49811 ,  H01L23/5386 ,  H01L24/14

Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.

公开(公告)号：US12183683B2

公开(公告)日：2024-12-31

申请号：US17501952

申请日：2021-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Jen Wang ,  Po-Jen Cheng ,  Fu-Yuan Chen

IPC: H01L23/538 ,  H01L21/48 ,  H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L23/31

Abstract: An electronic package structure includes an electronic structure, a wiring structure, an electrical contact and a support layer. The wiring structure is located over the electronic structure. The electrical contact connects the wiring structure and the electronic structure. The support layer is disposed around the electrical contact and has a surface facing the electrical contact. The surface includes at least one inflection point in a cross-sectional view.