公开(公告)号：US20230057327A1

公开(公告)日：2023-02-23

申请号：US17407067

申请日：2021-08-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Wen LU ,  Chun-Jen CHEN ,  Po-Hsiang TSENG ,  Hsin-Han LIN ,  Ming-Lun YU

IPC: H04B1/525 ,  H04B1/04 ,  H04B1/10 ,  H04B1/48

Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.

公开(公告)号：US20210050649A1

公开(公告)日：2021-02-18

申请号：US16538592

申请日：2019-08-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01Q1/22 ,  H01Q9/04 ,  H01L23/31 ,  H01Q1/38 ,  H01L23/66

Abstract: A semiconductor device package includes a substrate, a first antenna and a second antenna. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The first antenna pattern has a first port configured to generate a magnetic field. The second antenna pattern is disposed over the first surface of the substrate. The second antenna pattern has a second bandwidth different from the first bandwidth. A prolonged line of an edge of the first antenna pattern parallel to the magnetic field generated by the first port of the first antenna pattern is spaced apart from the second antenna pattern.

公开(公告)号：US20250167440A1

公开(公告)日：2025-05-22

申请号：US19033476

申请日：2025-01-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q5/378 ,  H01Q21/06

Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.

公开(公告)号：US20240347909A1

公开(公告)日：2024-10-17

申请号：US18134514

申请日：2023-04-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01Q5/307 ,  H01Q15/00 ,  H01Q21/06

CPC classification number: H01Q5/307 ,  H01Q15/0013 ,  H01Q21/065 ,  H01Q19/062

Abstract: The present disclosure provides an antenna package structure, including a first antenna and a first frequency selective surface structure. The first frequency selective surface structure is disposed above the first antenna, and includes a plurality of first patterns and a plurality of second patterns geometrically distinct from the plurality of the first patterns. The plurality of first patterns and the plurality of second patterns are configured to enhance gain and directivity of the first antenna.

公开(公告)号：US20190164916A1

公开(公告)日：2019-05-30

申请号：US16262768

申请日：2019-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01L23/66 ,  H01Q19/28 ,  H01Q19/08 ,  H01Q13/02 ,  H01P3/12 ,  H01Q13/08 ,  H01Q1/22 ,  H01P3/08 ,  H01L23/31 ,  H01L23/498

Abstract: An antenna semiconductor package device includes: (1) a waveguide cavity having a radiation opening; and (2) a first directing element outside of the waveguide cavity and separated from the waveguide cavity by a first gap.

公开(公告)号：US20240275061A1

公开(公告)日：2024-08-15

申请号：US18108498

申请日：2023-02-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01Q13/10 ,  H01P3/08 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01Q13/10 ,  H01P3/08 ,  H05K1/0243 ,  H05K1/115 ,  H05K2201/10098

Abstract: The present disclosure provides an electronic device. The electronic device includes a radio frequency (RF) circuit region and an antenna region. The RF circuit region has a first circuit density. The antenna region includes a circuit structure. The circuit structure defines a waveguide. The circuit structure has a second circuit density less than the first circuit density.

公开(公告)号：US20240154642A1

公开(公告)日：2024-05-09

申请号：US18414372

申请日：2024-01-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Wen LU ,  Chun-Jen CHEN ,  Po-Hsiang TSENG ,  Hsin-Han LIN ,  Ming-Lun YU

IPC: H04B1/525 ,  H04B1/04 ,  H04B1/10 ,  H04B1/48

CPC classification number: H04B1/525 ,  H04B1/0475 ,  H04B1/1009 ,  H04B1/48 ,  H04B2001/485

Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.

公开(公告)号：US20240038678A1

公开(公告)日：2024-02-01

申请号：US17877796

申请日：2022-07-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Yu CHEN ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01L23/552 ,  H01L25/10 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/552 ,  H01L25/105 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/162

Abstract: The present disclosure provides an electronic device. The electronic device includes a first interposer, a first interconnection array, a first shielding wall, and a second interconnection array. The first interconnection array is disposed in the first interposer and electrically connected to ground. The first shielding wall continuously extends at a side of the first interconnection array. The second interconnection array is disposed between the first shielding wall and the first interconnection array. The second interconnection array is configured to transmit a signal.

公开(公告)号：US20230055717A1

公开(公告)日：2023-02-23

申请号：US17407066

申请日：2021-08-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Wen LU

IPC: H01Q21/29 ,  H01Q13/18 ,  H01Q3/22

Abstract: The present disclosure relates to an electronic device that includes a first radiating element configured to radiate a first electromagnetic wave and a second radiating element configured to radiate a second electromagnetic wave. A first radiation pattern of the first electromagnetic wave is configured to be adjusted, and a second radiation pattern of the second electromagnetic wave is configured to be fixed.

公开(公告)号：US20220068774A1

公开(公告)日：2022-03-03

申请号：US17010714

申请日：2020-09-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Wen LU

IPC: H01L23/495 ,  H01L23/06 ,  H01L23/538 ,  H01P3/00

Abstract: A semiconductor device package includes a substrate and a conductive lid. The conductive lid is disposed within the substrate. The conductive lid defines a waveguide having a cavity. The waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.