-
公开(公告)号：US12206165B2
公开(公告)日：2025-01-21
申请号：US18206580
申请日：2023-06-06
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En Hsu , Huei-Shyong Cho , Shih-Wen Lu
Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.
-
公开(公告)号：US11901270B2
公开(公告)日：2024-02-13
申请号：US17010714
申请日：2020-09-02
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shih-Wen Lu
IPC: H01L23/495 , H01P3/00 , H01L23/538 , H01L23/06
CPC classification number: H01L23/49575 , H01L23/06 , H01L23/5384 , H01P3/00
Abstract: A semiconductor device package includes a substrate and a conductive lid. The conductive lid is disposed within the substrate. The conductive lid defines a waveguide having a cavity. The waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.
-
公开(公告)号：US11670846B2
公开(公告)日：2023-06-06
申请号：US17327644
申请日：2021-05-21
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En Hsu , Huei-Shyong Cho , Shih-Wen Lu
CPC classification number: H01Q1/523 , H01Q1/2283 , H01Q1/243 , H01Q1/48 , H01Q5/378 , H01Q21/061
Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.
-
公开(公告)号：US10530038B2
公开(公告)日：2020-01-07
申请号：US15913856
申请日：2018-03-06
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En Hsu , Huei-Shyong Cho , Shih-Wen Lu
IPC: H01Q1/22 , H01L23/367 , H01L23/498 , H01Q1/02 , H01Q1/24 , H01Q21/06 , H01L23/66
Abstract: A semiconductor package device includes a substrate, an antenna and a conductor. The substrate has an upper surface. The antenna is disposed on the upper surface of the substrate. The conductor is disposed on the upper surface of the substrate and surrounds the antenna. The conductor has a first surface facing toward the antenna and a second surface opposite to the first surface. The second surface of the conductor is spaced apart from the upper surface of the substrate.
-
公开(公告)号：US10199336B2
公开(公告)日：2019-02-05
申请号：US15604545
申请日：2017-05-24
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En Hsu , Huei-Shyong Cho , Shih-Wen Lu
Abstract: An antenna semiconductor package device includes a first conductive layer, a second conductive layer, a first conductive element and a first directing element. The second conductive layer is over the first conductive layer and separated from the first conductive layer. The first conductive element connects the first conductive layer to the second conductive layer. The first directing element is adjacent to the first conductive layer and separated from the first conductive layer by a first gap. The first conductive element, the first conductive layer and the second conductive layer define a waveguide cavity and a radiation opening.
-
Patent Agency Ranking
公开(公告)号：US11876551B2
公开(公告)日：2024-01-16
申请号：US17407067
申请日：2021-08-19
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shih-Wen Lu , Chun-Jen Chen , Po-Hsiang Tseng , Hsin-Han Lin , Ming-Lun Yu
CPC classification number: H04B1/525 , H04B1/0475 , H04B1/1009 , H04B1/48 , H04B2001/485
Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.
-
公开(公告)号：US20190280367A1
公开(公告)日：2019-09-12
申请号：US15913856
申请日：2018-03-06
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En Hsu , Huei-Shyong Cho , Shih-Wen Lu
IPC: H01Q1/22 , H01L23/367 , H01L23/498 , H01L23/66 , H01Q1/02 , H01Q1/24 , H01Q21/06
Abstract: A semiconductor package device includes a substrate, an antenna and a conductor. The substrate has an upper surface. The antenna is disposed on the upper surface of the substrate. The conductor is disposed on the upper surface of the substrate and surrounds the antenna. The conductor has a first surface facing toward the antenna and a second surface opposite to the first surface. The second surface of the conductor is spaced apart from the upper surface of the substrate
-
公开(公告)号：US11108131B2
公开(公告)日：2021-08-31
申请号：US16538592
申请日：2019-08-12
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En Hsu , Huei-Shyong Cho , Shih-Wen Lu
Abstract: A semiconductor device package includes a substrate, a first antenna and a second antenna. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The first antenna pattern has a first port configured to generate a magnetic field. The second antenna pattern is disposed over the first surface of the substrate. The second antenna pattern has a second bandwidth different from the first bandwidth. A prolonged line of an edge of the first antenna pattern parallel to the magnetic field generated by the first port of the first antenna pattern is spaced apart from the second antenna pattern.
-
公开(公告)号：US10546825B2
公开(公告)日：2020-01-28
申请号：US16262768
申请日：2019-01-30
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En Hsu , Huei-Shyong Cho , Shih-Wen Lu
IPC: H01L23/66 , H01L23/31 , H01L23/498 , H01Q1/22 , H01P3/12 , H01Q13/02 , H01Q19/08 , H01Q19/28 , H01P3/08 , H01Q13/08
Abstract: An antenna semiconductor package device includes: (1) a waveguide cavity having a radiation opening; and (2) a first directing element outside of the waveguide cavity and separated from the waveguide cavity by a first gap.
-
公开(公告)号：US11997783B2
公开(公告)日：2024-05-28
申请号：US17827546
申请日：2022-05-27
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Po-An Lin , Huei-Shyong Cho , Shih-Wen Lu
CPC classification number: H05K1/024 , H05K1/16 , H05K2201/10098
Abstract: The present disclosure provides an electronic device. The electronic device includes a first insulating layer, a first antenna pattern, a second insulating layer, and a second antenna pattern. The first antenna pattern is configured to operate at a first frequency and at least partially disposed over the first insulating layer. The second insulating layer is disposed over the first insulating layer. The second antenna pattern is configured to operate at a second frequency different from the first frequency and at least partially disposed over the second insulating layer. A dielectric constant of the first insulating layer is different from a dielectric constant of the second insulating layer.
-
-
-
-
-
-
-
-
-
Search Results
12
records
(took 0.013 seconds)
