公开(公告)号：US09181933B2

公开(公告)日：2015-11-10

申请号：US13710052

申请日：2012-12-10

Applicant: Alcatel-Lucent Ireland Ltd.

Inventor： John Daly ,  Nick Jeffers

IPC: F01B29/10 ,  F03G7/06

CPC classification number: F03G7/065 ,  Y10T29/49826

Abstract: A device, comprising a flow controller. The flow controller includes a body having walls that define a channel within the body, and a passive flow control valve. The passive control valve has a moveable member that includes a thermal shape memory material, the moveable member configured to change an aperture size in the channel in response to a reversible temperature-induced shape transformation of the thermal shape memory material.

Abstract translation: 一种装置，包括流量控制器。 流量控制器包括具有限定主体内的通道的壁的主体和被动流量控制阀。 被动控制阀具有包括热形状记忆材料的可移动构件，可移动构件被配置成响应于热形状记忆材料的可逆温度引起的形状变换而改变通道中的孔径尺寸。

公开(公告)号：US20140157769A1

公开(公告)日：2014-06-12

申请号：US13710052

申请日：2012-12-10

Applicant: ALCATEL-LUCENT IRELAND LTD.

Inventor： John Daly ,  Nick Jeffers

IPC: F03G7/06

CPC classification number: F03G7/065 ,  Y10T29/49826

Abstract: A device, comprising a flow controller. The flow controller includes a body having walls that define a channel within the body, and a passive flow control valve. The passive control valve has a moveable member that includes a thermal shape memory material, the moveable member configured to change an aperture size in the channel in response to a reversible temperature-induced shape transformation of the thermal shape memory material.

Abstract translation: 一种装置，包括流量控制器。 流量控制器包括具有限定主体内的通道的壁的主体和被动流量控制阀。 被动控制阀具有包括热形状记忆材料的可移动构件，可移动构件被配置成响应于热形状记忆材料的可逆温度引起的形状变换而改变通道中的孔径尺寸。

公开(公告)号：US09113576B2

公开(公告)日：2015-08-18

申请号：US13690450

申请日：2012-11-30

Applicant: Alcatel Lucent

Inventor： John Daly

IPC: H05K7/20 ,  H01S5/024 ,  H01L23/473 ,  H01S3/04

CPC classification number: H05K7/20281 ,  H01L23/473 ,  H01L2924/0002 ,  H01S3/0407 ,  H01S5/02423 ,  H01L2924/00

Abstract: A photonics assembly (8-16) is housed within an hermetically sealed container (24) mounted within an outer container (20), and is cooled by a fluidic arrangement comprising a liquid flow path (28) defined between the outer container and the sealed container, the outer container having a liquid inlet and a liquid outlet (30, 32), whereby cooling liquid can flow around the hermetically sealed container to remove heat. The photonics assembly including photonics devices, has a composite thermally conductive substrate (17, 19) contacting a thermally conductive wall (22) of the sealed container, whereby the cooling liquid cools said photonics devices. Liquid flow passageways (48-66) are provided in wall (22) and substrate (17, 19) for improving fluidic cooling.

Abstract translation: 光子组件（8-16）容纳在安装在外部容器（20）内的气密密封的容器（24）内，并被流体装置冷却，流体装置包括限定在外部容器和密封的外部容器 容器，外容器具有液体入口和液体出口（30,32），由此冷却液体可以在密封容器周围流动以除去热量。 包括光子器件的光子学组件具有接触密封容器的导热壁（22）的复合导热衬底（17,19），由此冷却液冷却所述光子器件。 液体流动通道（48-66）设置在壁（22）和基底（17,19）中，用于改善流体冷却。

公开(公告)号：US20150077937A1

公开(公告)日：2015-03-19

申请号：US14026992

申请日：2013-09-13

Applicant: Alcatel Lucent

Inventor： John Daly ,  Brian Donnelly ,  Nicholas Jeffers ,  Wei Ling ,  Salvatore J. Messana ,  Paul M. Rominski

IPC: H05K7/20 ,  H04B10/40

CPC classification number: H04B10/40 ,  G02B6/4261 ,  G02B6/4268 ,  G02B6/428 ,  G06F2200/201 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus comprising a fluid-circulator loop configured to be located on a circuit board, wherein a heat-removal portion of the fluid-circulator loop is configured to be located adjacent to an optical transceiver module on the circuit board.

Abstract translation: 一种包括流体循环器回路的装置，其被配置为位于电路板上，其中流体循环器回路的散热部分被配置为位于电路板上的光收发器模块附近。