公开(公告)号：US20250167786A1

公开(公告)日：2025-05-22

申请号：US19029471

申请日：2025-01-17

Applicant: Altera Corporation

Inventor： Sharath Raghava ,  Ankireddy Nalamalpu ,  Dheeraj Subbareddy ,  Harsha Gupta ,  James Ball ,  Kavitha Prasad ,  Sean R. Atsatt

IPC: H03K19/17736 ,  H03K19/17796 ,  H04L41/5003 ,  H04L41/5019

Abstract: Techniques described herein may relate to providing a programmable interconnect network (e.g., a programmable network-on-chip (NOC)). A method may include determining a transmission parameter, bonding one or more channels of an interconnect network based at least in part on the transmission parameter, and power-gating any unused channels after the bonding.

公开(公告)号：US20250077753A1

公开(公告)日：2025-03-06

申请号：US18951492

申请日：2024-11-18

Applicant: Altera Corporation

Inventor： Chee Hak Teh ,  Ankireddy Nalamalpu ,  MD Altaf Hossain ,  Dheeraj Subbareddy ,  Sean R. Atsatt ,  Lai Guan Tang

IPC: G06F30/34 ,  G06F15/78 ,  H03K19/17736 ,  H03K19/17796 ,  H04L12/43

Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.