公开(公告)号：US20130129136A1

公开(公告)日：2013-05-23

申请号：US13661401

申请日：2012-10-26

Applicant: Analog Devices, Inc.

Inventor： Kieran P. Harney ,  Dipak Sengupta ,  Brian Moss ,  Alain V. Guery

IPC: H04R1/04

CPC classification number: H04R1/342 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/04 ,  H04R1/08 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

Abstract translation: 麦克风模块具有带孔的基板，以允许声波通过基板，安装到基板上以限定第一内部空间的盖，安装到第一内部空间内的基板的麦克风以及耦合到该基板的壳体 衬底并覆盖孔径。 壳体形成第二内部容积并且包括被配置为允许声音进入第二内部容积的声学端口。 模块还包括从壳体中的声学接口延伸的管道，以及在第二内部容积体外部的至少一个外部接口焊盘。 管道具有接收声波的开口端，并将它们引导到壳体中的声学端口。 此外，至少一个外部接口垫电连接到麦克风。

公开(公告)号：US08767982B2

公开(公告)日：2014-07-01

申请号：US13661401

申请日：2012-10-26

Applicant: Analog Devices, Inc.

Inventor： Kieran P. Harney ,  Dipak Sengupta ,  Brian Moss ,  Alain V. Guery

IPC: H04R25/00

CPC classification number: H04R1/342 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/04 ,  H04R1/08 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

Abstract translation: 麦克风模块具有带孔的基板，以允许声波通过基板，安装到基板上以限定第一内部空间的盖，安装到第一内部空间内的基板的麦克风以及耦合到该基板的壳体 衬底并覆盖孔径。 壳体形成第二内部容积并且包括被配置为允许声音进入第二内部容积的声学端口。 模块还包括从壳体中的声学接口延伸的管道，以及在第二内部容积体外部的至少一个外部接口焊盘。 管道具有接收声波的开口端，并将它们引导到壳体中的声学端口。 此外，至少一个外部接口垫电连接到麦克风。