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公开(公告)号：US12241689B2
公开(公告)日：2025-03-04
申请号：US16777654
申请日：2020-01-30
Applicant: Analog Devices, Inc.
Inventor： Marc T. Dunham , Baoxing Chen
Abstract: A heat transfer element is disclosed. The heat transfer element can be configured to directly bond to a metal surface of an element. The heat transfer element can include a chamber that is defined at least in part by a housing that has a metal portion. The heat transfer element can also include a phase change material disposed in the chamber. The phase change material can be in thermal communication with the metal portion. The Heat transfer element can be bonded to the element to define a bonded structure.
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公开(公告)号：US20210239405A1
公开(公告)日：2021-08-05
申请号：US16777654
申请日：2020-01-30
Applicant: Analog Devices, Inc.
Inventor： Marc T. Dunham , Baoxing Chen
Abstract: A heat transfer element is disclosed. The heat transfer element can be configured to directly bond to a metal surface of an element. The heat transfer element can include a chamber that is defined at least in part by a housing that has a metal portion. The heat transfer element can also include a phase change material disposed in the chamber. The phase change material can be in thermal communication with the metal portion. The Heat transfer element can be bonded to the element to define a bonded structure.
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