公开(公告)号：US06635865B1

公开(公告)日：2003-10-21

申请号：US09624719

申请日：2000-07-25

Applicant: Andrew J. Soltyk

Inventor： Andrew J. Soltyk

IPC: H01J502

CPC classification number: H04N1/02805 ,  A61B1/05 ,  H04N5/2253 ,  H04N2005/2255 ,  H05K1/14

Abstract: A Solid State Imaging Sensor Microassembly for miniature, remote head video cameras having small imaging sensor (10) and two circuits boards, top board (30) and bottom board (32). The imaging sensor of the type without a package and protected by the glass cover only, with leads (26) attached directly to the silicon chip (22). The sensor leads (26) bonded to opposite edges of the top board (30) placing the imager (10) in parallel alignment to the top board (30) some distance from it. Alternatively the packageless and leadless imaging sensor (12), bonded and connected to the top surface of the top circuit board (60) by the grid of small solder balls (66). Second circuit board (32) bonded perpendicularly and off center to the other side of top board (32) forming structure of an unsymmetrical capital T with one arm shorter than the other. In addition electronics components (34) are sandwiched between the imager (10) and top board (30) and still other components (38) are placed on one of the surfaces of the bottom board (32) which surface is facing away from the center of top board (30). Other surface of the bottom board (32) which is facing towards the center of the top board (30) has transmission cable conductors (36) attached.

Abstract translation: 用于具有小成像传感器（10）和两个电路板，顶板（30）和底板（32）的微型远程头摄像机的固态成像传感器微组件。 该类型的成像传感器没有封装，仅由玻璃盖保护，引线（26）直接连接到硅芯片（22）。 接合到顶板（30）的相对边缘的传感器引线（26）将成像器（10）平行地对准到离它一定距离的顶板（30）。 可选地，无封装和无引线成像传感器（12）通过小焊球（66）的格栅结合并连接到顶部电路板（60）的顶表面。 第二电路板（32）垂直地离开并离开顶板（32）的另一侧，形成不对称资本T的结构，其中一个臂比另一个臂短。 此外，电子部件（34）夹在成像器（10）和顶板（30）之间，并且其它部件（38）被放置在底板（32）的一个表面上，该表面面向远离中心 的顶板（30）。 底板（32）的面向顶板（30）的中心的其他表面具有附接的传输电缆导体（36）。