公开(公告)号：US20250014960A1

公开(公告)日：2025-01-09

申请号：US18348934

申请日：2023-07-07

Applicant: Apple Inc.

Inventor： Jiongxin LU ,  Kunzhong Hu ,  Jun Zhai

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

Abstract: Various embodiments of an integrated circuit (IC) die package are disclosed. An IC die package includes an IC die, an interposer structure electrically connected to the IC die, a first bonding structure, a second bonding structure, and a molding compound layer. The first bonding structure includes a first dielectric layer disposed on the IC die and a first conductive plug disposed in the first dielectric layer. The second bonding structure includes a second dielectric layer disposed on the interposer structure and a second conductive plug disposed in the second dielectric layer. The molding compound layer includes a mold region and a mold cavity.

公开(公告)号：US20250015027A1

公开(公告)日：2025-01-09

申请号：US18348925

申请日：2023-07-07

Applicant: Apple Inc.

Inventor： Jiongxin LU ,  Kunzhong HU

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/498

Abstract: Various embodiments of an integrated circuit (IC) die package are disclosed. An IC die package includes an IC die, an interposer structure electrically connected to the IC die, a first bonding structure, and a second bonding structure. The first bonding structure includes a first dielectric layer disposed on the IC die and also includes a first conductive pad having an embedded portion disposed in the first dielectric layer and an anchor portion extending over a top surface of the first dielectric layer. The second bonding structure includes a second dielectric layer disposed on the interposer structure, a second conductive pad disposed in the second dielectric layer, and an anchor layer surrounding the anchor portion.

公开(公告)号：US20250112176A1

公开(公告)日：2025-04-03

申请号：US18530291

申请日：2023-12-06

Applicant: Apple Inc.

Inventor： Jiongxin LU ,  Kunzhong Hu

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/28

Abstract: Various embodiments of an integrated circuit (IC) die package are disclosed. An IC die package includes an IC die, an interposer die electrically connected to the IC die, a first bonding structure disposed on the IC die, a second bonding structure bonded to the first bonding structure, a molding compound layer disposed on the second bonding structure and a frame structure disposed on the second bonding structure and surrounding the IC die.