Beam-tilting light source enclosures

    公开(公告)号:US11619762B2

    公开(公告)日:2023-04-04

    申请号:US17571985

    申请日:2022-01-10

    Applicant: Apple Inc.

    Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

    Beam-Tilting Light Source Enclosures

    公开(公告)号:US20220128730A1

    公开(公告)日:2022-04-28

    申请号:US17571985

    申请日:2022-01-10

    Applicant: Apple Inc.

    Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

    BEAM-TILTING LIGHT SOURCE ENCLOSURES

    公开(公告)号:US20240418904A1

    公开(公告)日:2024-12-19

    申请号:US18816209

    申请日:2024-08-27

    Applicant: Apple Inc.

    Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

    Optical Module Component Features that Aid Adhesive Attachment

    公开(公告)号:US20200264401A1

    公开(公告)日:2020-08-20

    申请号:US16277174

    申请日:2019-02-15

    Applicant: Apple Inc.

    Abstract: A cap for an optical module includes features that aid in adhesive attachment. In some examples, the cap includes a standoff configured to initiate capillary action upon contacting adhesive on a substrate to move the cap toward the substrate and an alignment feature configured to control lateral movement of the cap with respect to the substrate as the capillary action moves the cap toward the substrate. In other examples, the cap includes a standoff configured to initiate movement of an adhesive away from a substrate via surface tension and wetting upon contacting the adhesive and an alignment feature is configured to control lateral movement of the cap with respect to the substrate as the adhesive moves away from the substrate.

    Beam-Tilting Light Source Enclosures
    6.
    发明申请

    公开(公告)号:US20200096669A1

    公开(公告)日:2020-03-26

    申请号:US16537086

    申请日:2019-08-09

    Applicant: Apple Inc.

    Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

    Beam-tilting light source enclosures

    公开(公告)号:US12105248B2

    公开(公告)日:2024-10-01

    申请号:US18388140

    申请日:2023-11-08

    Applicant: Apple Inc.

    Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

    Beam-tilting light source enclosures

    公开(公告)号:US12105247B2

    公开(公告)日:2024-10-01

    申请号:US18197882

    申请日:2023-05-16

    Applicant: Apple Inc.

    Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

    Beam-tilting light source enclosures

    公开(公告)号:US11366246B2

    公开(公告)日:2022-06-21

    申请号:US16537086

    申请日:2019-08-09

    Applicant: Apple Inc.

    Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

    Beam-Tilting Light Source Enclosures
    10.
    发明公开

    公开(公告)号:US20240069241A1

    公开(公告)日:2024-02-29

    申请号:US18388140

    申请日:2023-11-08

    Applicant: Apple Inc.

    CPC classification number: G01V8/12 F21V3/02 F21V5/04 F21V17/101

    Abstract: An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.

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