公开(公告)号：US20240094153A1

公开(公告)日：2024-03-21

申请号：US18521585

申请日：2023-11-28

Applicant: Apple Inc.

Inventor： Michael K. McCord ,  Stacy H. Mo

IPC: G01N27/04 ,  G01R31/26 ,  G02B5/02

CPC classification number: G01N27/041 ,  G01N27/045 ,  G01R31/2635 ,  G02B5/02

Abstract: Optical component integrity monitoring circuitry monitors an optical component integrity sensing path in an optical component. If a rise in resistance of the sensing path is detected, the circuitry prevents the optical component from emitting light. The optical component may have a light-emitting device that emits light through an optical element. The sensing path may have a first path that is used to detect damage to the optical element and a second path that is coupled to a package covering the optical element and light-emitting device. The first path may have a segment formed from a metal trace on the optical element and a segment formed from a wire bond, providing mechanical compliance to tolerate strains expected in the use case. The second path ensures that the package is present to constrain movement of the optical element and its wires within a safe envelope defined by the package interior.

公开(公告)号：US11867650B2

公开(公告)日：2024-01-09

申请号：US17223674

申请日：2021-04-06

Applicant: Apple Inc.

Inventor： Michael K. McCord ,  Stacy H. Mo

IPC: G01N27/41 ,  G01N27/04 ,  G02B5/02 ,  G01R31/26

CPC classification number: G01N27/041 ,  G01N27/045 ,  G01R31/2635 ,  G02B5/02

Abstract: Optical component integrity monitoring circuitry monitors an optical component integrity sensing path in an optical component. If a rise in resistance of the sensing path is detected, the circuitry prevents the optical component from emitting light. The optical component may have a light-emitting device that emits light through an optical element. The sensing path may have a first path that is used to detect damage to the optical element and a second path that is coupled to a package covering the optical element and light-emitting device. The first path may have a segment formed from a metal trace on the optical element and a segment formed from a wire bond, providing mechanical compliance to tolerate strains expected in the use case. The second path ensures that the package is present to constrain movement of the optical element and its wires within a safe envelope defined by the package interior.

公开(公告)号：US20220317076A1

公开(公告)日：2022-10-06

申请号：US17223674

申请日：2021-04-06

Applicant: Apple Inc.

Inventor： Michael K. McCord ,  Stacy H. Mo

IPC: G01N27/04 ,  G02B5/02

Abstract: Optical component integrity monitoring circuitry monitors an optical component integrity sensing path in an optical component. If a rise in resistance of the sensing path is detected, the circuitry prevents the optical component from emitting light. The optical component may have a light-emitting device that emits light through an optical element. The sensing path may have a first path that is used to detect damage to the optical element and a second path that is coupled to a package covering the optical element and light-emitting device. The first path may have a segment formed from a metal trace on the optical element and a segment formed from a wire bond, providing mechanical compliance to tolerate strains expected in the use case. The second path ensures that the package is present to constrain movement of the optical element and its wires within a safe envelope defined by the package interior.