公开(公告)号：US10021808B1

公开(公告)日：2018-07-10

申请号：US15593245

申请日：2017-05-11

Applicant: Apple Inc.

Inventor： Eric N. Nyland ,  Michael Benjamin Wittenberg ,  Timothy Y. Lee

IPC: H05K7/20 ,  H05K5/02

CPC classification number: H05K7/20009 ,  H04M1/0202 ,  H04M2250/22 ,  H05K5/0213 ,  H05K5/0217

Abstract: A vent assembly in an electronic device is described. The vent assembly may regulate air into and out of the electronic device. The vent assembly may include multiple layers of material bonded together, with each layer having a flap (or flaps) that combines with another flap to form a valve. The vent assembly may include a first layer bonded with a second layer. The first layer includes a first flap, and the second layer includes a second flap that combines with the first flap to form a first valve that regulates air out of the electronic device. The vent assembly can include a third layer. Then, the second layer includes a third flap, and the third layer includes a fourth flap that combines with the third flap to form a second valve that regulates air into the electronic device. In some instances, each valve may permit airflow in one direction.