公开(公告)号：USD954769S1

公开(公告)日：2022-06-14

申请号：US29736743

申请日：2020-06-02

Applicant: Applied Materials, Inc.

Designer： Aaron Green ,  Nicholas Michael Bergantz

公开(公告)号：US20240025670A1

公开(公告)日：2024-01-25

申请号：US18375409

申请日：2023-09-29

Applicant: Applied Materials, Inc.

Inventor： Aaron Green ,  Nicholas Michael Bergantz ,  Damon K. Cox ,  Andreas Schmid

IPC: B65G47/90 ,  B25J15/08

CPC classification number: B65G47/90 ,  B25J15/08

Abstract: A carrier includes a carrier body configured to be supported on a robot to transport one or more process kit rings within a substrate processing system. The carrier further includes fingers extending from the carrier body. The fingers are configured to support the one or more process kit rings. A first finger of the plurality of fingers includes an upper surface that forms a recess to receive the one or more process kit rings.

公开(公告)号：US12027397B2

公开(公告)日：2024-07-02

申请号：US17206036

申请日：2021-03-18

Applicant: Applied Materials, Inc.

Inventor： Aaron Green ,  Nicholas Michael Bergantz ,  John C. Menk

IPC: H01L21/673

CPC classification number: H01L21/67383

Abstract: A set of one or more shelves is configured to be disposed within an enclosure system of a substrate processing system. The set of one or more shelves includes first upper surfaces disposed substantially in a first plane, carrier alignment features configured to align a carrier on the first upper surfaces, second upper surfaces disposed substantially in a second plane that is above the first plane, and process kit ring alignment features configured to align a process kit ring on the carrier above the second upper surfaces.

公开(公告)号：US20240429079A1

公开(公告)日：2024-12-26

申请号：US18759704

申请日：2024-06-28

Applicant: Applied Materials, Inc.

Inventor： Aaron Green ,  Nicholas Michael Bergantz ,  John C. Menk

IPC: H01L21/673

Abstract: A shelf system includes a first distal portion configured to be fastened to a first surface of an enclosure system. The first distal portion includes a first carrier alignment feature and a first process kit ring alignment feature. The shelf system further includes a second distal portion configured to be fastened to a second surface of the enclosure system. The second distal portion includes a second carrier alignment feature and a second process kit ring alignment feature. The first carrier alignment feature and the second carrier alignment feature are configured to be disposed proximate outer surfaces of a carrier to align the carrier in the enclosure system. The first process kit ring alignment feature and the second process kit ring alignment feature are configured to be proximate inner surfaces of a process kit ring to align the process kit ring on the carrier in the enclosure system.

公开(公告)号：USD980176S1

公开(公告)日：2023-03-07

申请号：US29736744

申请日：2020-06-02

Applicant: Applied Materials, Inc.

Designer： Aaron Green ,  Nicholas Michael Bergantz

公开(公告)号：US20210296149A1

公开(公告)日：2021-09-23

申请号：US17206036

申请日：2021-03-18

Applicant: Applied Materials, Inc.

Inventor： Aaron Green ,  Nicholas Michael Bergantz ,  John C. Menk

IPC: H01L21/673

Abstract: A set of one or more shelves is configured to be disposed within an enclosure system of a substrate processing system. The set of one or more shelves includes first upper surfaces disposed substantially in a first plane, carrier alignment features configured to align a carrier on the first upper surfaces, second upper surfaces disposed substantially in a second plane that is above the first plane, and process kit ring alignment features configured to align a process kit ring on the carrier above the second upper surfaces.

公开(公告)号：US20210292104A1

公开(公告)日：2021-09-23

申请号：US17205878

申请日：2021-03-18

Applicant: Applied Materials, Inc.

Inventor： Aaron Green ,  Nicholas Michael Bergantz ,  Damon K. Cox ,  Andreas Schmid

IPC: B65G47/90 ,  B25J15/08

Abstract: A carrier includes a rigid body forming a plurality of openings and a plurality of fasteners configured to removably attach to the rigid body via the plurality of openings. A first set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The first set of fingers is configured to support first content during first transportation of the carrier within a substrate processing system. A second set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The second set of fingers is configured to support second content during second transportation of the carrier within the substrate processing system.