公开(公告)号：US20220055181A1

公开(公告)日：2022-02-24

申请号：US17407052

申请日：2021-08-19

Applicant: Applied Materials, Inc.

Inventor： Aniruddh Jagdish Khanna ,  Daniel Redfield ,  Ehud Chatow ,  Kenneth Mason ,  Steven Turner ,  Rajeev Bajaj ,  Kieran Joseph Rynne ,  Periya G. Gopalan

IPC: B24B37/32

Abstract: The present disclosure relates to retaining rings that include tunable chemical, material and structural properties, improved structural and fluid transport configurations and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a retaining ring with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure provide an advanced retaining ring that has discrete features and geometries, formed from at least two different materials that are formed from one or more polymers. The layers and/or regions of the advanced retaining ring may include a composite material structure, such as a polymer that contains at least one filler, such as metals, semimetal oxides, carbides, nitrides and/or polymer particles.

公开(公告)号：US20220384278A1

公开(公告)日：2022-12-01

申请号：US17334407

申请日：2021-05-28

Applicant: Applied Materials, Inc.

Inventor： Justin Wong ,  Ehud Chatow

IPC: H01L21/66 ,  H01L21/02 ,  H01L21/321 ,  H01L21/67 ,  B24B37/005

Abstract: Wafers that begin as flat surfaces during a semiconductor manufacturing process may become warped or bowed as layers and features are added to an underlying substrate. This warpage may be detected between manufacturing processes by rotating the wafer adjacent to a displacement sensor. The displacement sensor may generate displacement data relative to a baseline measurement to identify areas of the wafer that bow up or down. The displacement data may then be mapped to locations on the wafer relative to an alignment feature. This mapping may then be used to adjust parameters in subsequent semiconductor processes, including adjusting how a carrier head on a polishing process holds or applies pressure to the wafer as it is polished.

公开(公告)号：US20220384221A1

公开(公告)日：2022-12-01

申请号：US17731124

申请日：2022-04-27

Applicant: Applied Materials, Inc.

Inventor： Justin H. Wong ,  Ehud Chatow

IPC: H01L21/67 ,  G01S17/08 ,  H01L21/687 ,  H01L21/66 ,  G05B13/02

Abstract: Wafers that begin as flat surfaces during a semiconductor manufacturing process may become warped or bowed as layers and features are added to an underlying substrate. This warpage may be detected between manufacturing processes by rotating the wafer adjacent to a displacement sensor. The displacement sensor may generate displacement data relative to a baseline measurement to identify areas of the wafer that bow up or down. The displacement data may then be mapped to locations on the wafer relative to an alignment feature. This mapping may then be used to adjust parameters in subsequent semiconductor processes, including adjusting how a carrier head on a polishing process holds or applies pressure to the wafer as it is polished. A model may be trained to provide control signals for a polishing/cleaning process, or to generate metrology data.