公开(公告)号：US20210183620A1

公开(公告)日：2021-06-17

申请号：US16713615

申请日：2019-12-13

Applicant: Applied Materials, Inc.

Inventor： Wei Tian ,  Toan Q. Tran ,  Dmitry Lubomirsky ,  Greg Toland ,  Satoru Kobayashi

IPC: H01J37/32 ,  H01L21/67

Abstract: Exemplary processing chambers may include a chamber housing at least partially defining an interior region of the semiconductor processing chamber. The chambers may include a showerhead positioned within the chamber housing. The showerhead may at least partially separate the interior region into a remote region and a processing region. Sidewalls of the chamber housing may at least partially define the processing region. The chambers may include a substrate support extending into the processing region and configured to support a substrate. The chambers may include an inductively-coupled plasma source positioned between the showerhead and the substrate support. The inductively-coupled plasma source may include a conductive material disposed within a dielectric material. The inductively-coupled plasma source may form a portion of the sidewalls of the chamber housing.

公开(公告)号：US11715625B2

公开(公告)日：2023-08-01

申请号：US17017495

申请日：2020-09-10

Applicant: Applied Materials, Inc.

Inventor： Greg Toland ,  Kenneth D. Schatz ,  Laksheswar Kalita ,  Dmitry Lubomirsky

IPC: H01J37/32 ,  H01L21/67

CPC classification number: H01J37/3244 ,  H01J37/32183 ,  H01J37/32495 ,  H01J37/32522 ,  H01J37/32715 ,  H01L21/67069 ,  H01J2237/332 ,  H01J2237/334

Abstract: Exemplary semiconductor processing systems may include a pedestal configured to support a semiconductor substrate. The pedestal may be operable as a first plasma-generating electrode. The systems may include a lid plate defining a radial volume. The systems may include a faceplate supported with the lid plate. The faceplate may be operable as a second plasma-generating electrode. A plasma processing region may be defined between the pedestal and the faceplate within the radial volume defined by the faceplate. The faceplate may define a plurality of first apertures. The systems may include a showerhead positioned between the faceplate and the pedestal. The showerhead may define a plurality of second apertures comprising a greater number of apertures than the plurality of first apertures.

公开(公告)号：US20210082665A1

公开(公告)日：2021-03-18

申请号：US17017495

申请日：2020-09-10

Applicant: Applied Materials, Inc.

Inventor： Greg Toland ,  Kenneth D. Schatz ,  Laksheswar Kalita ,  Dmitry Lubomirsky

IPC: H01J37/32 ,  H01L21/67

Abstract: Exemplary semiconductor processing systems may include a pedestal configured to support a semiconductor substrate. The pedestal may be operable as a first plasma-generating electrode. The systems may include a lid plate defining a radial volume. The systems may include a faceplate supported with the lid plate. The faceplate may be operable as a second plasma-generating electrode. A plasma processing region may be defined between the pedestal and the faceplate within the radial volume defined by the faceplate. The faceplate may define a plurality of first apertures. The systems may include a showerhead positioned between the faceplate and the pedestal. The showerhead may define a plurality of second apertures comprising a greater number of apertures than the plurality of first apertures.