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    SUBSTRATE DEGAS STATION
    1.
    发明申请
    SUBSTRATE DEGAS STATION 有权

    公开(公告)号：US20250069915A1

    公开(公告)日：2025-02-27

    申请号：US18811911

    申请日：2024-08-22

    Applicant: Applied Materials, Inc.

    Inventor： Thomas BREZOCZKY ,  Punnati KRUSHNA REDDY ,  Azhar ALI M.A. ,  Kirankumar Neelasandra SAVANDAIAH ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Dhritiman Subha KASHYAP

    IPC: H01L21/67 ,  H01L21/324 ,  H01L21/677 ,  H01L21/687

    Abstract: Degas stations for degassing substrates that are conveyed through a substrate processing system on a magnetically levitated carrier and related methods are provided. The method includes magnetically levitating a carrier with a substrate disposed thereon in a first position between a reflector assembly and a heater assembly disposed within a housing of the station. The method further includes moving both the reflector assembly and the heater assembly from a retracted position to an extended position while the carrier is disposed between the reflector assembly and heater assembly. The method further includes degassing the substrate disposed on the carrier with the heater assembly while the reflector assembly and heater assembly are each in the extended position, wherein the degassing includes pumping a purge gas through a gas port formed in at least one of the reflector assembly or the heater assembly towards the substrate.

    SYSTEM FOR UNIFORM TEMPERATURE CONTROL OF CLUSTER PLATFORMS
    3.
    发明申请
    SYSTEM FOR UNIFORM TEMPERATURE CONTROL OF CLUSTER PLATFORMS 有权

    公开(公告)号：US20230116153A1

    公开(公告)日：2023-04-13

    申请号：US17851638

    申请日：2022-06-28

    Applicant: Applied Materials, Inc.

    Inventor： Lakshmikanth Krishnamurthy SHIRAHATTI ,  Kirankumar Neelasandra SAVANDAIAH ,  Prashant A. DESAI ,  Thomas BREZOCZKY

    IPC: H01L21/67

    Abstract: Aspects of the disclosure provided herein generally relate to a fluid flow network configured to cool subsystems of a substrate processing system. Aspects of the disclosure provide a fluid flow network and method that adjusts the flow of the cooling fluid through each subsystem of the substrate processing system. The methods described herein can include maintaining a flow rate of the cooling fluid through each subsystem over a range of cooling fluid pressures. The methods described herein can further include configuring the fluid flow network to equalize a flow rate of the cooling fluid through similar subsystems such that the flow rate through each subsystem is similar without adjustment.

    SEMICONDUCTOR PROCESS EQUIPMENT
    6.
    发明公开
    SEMICONDUCTOR PROCESS EQUIPMENT 审中-公开

    公开(公告)号：US20240153800A1

    公开(公告)日：2024-05-09

    申请号：US18141920

    申请日：2023-05-01

    Applicant: Applied Materials, Inc.

    Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Lakshmikanth Krishnamurthy SHIRAHATTI

    IPC: H01L21/677

    CPC classification number: H01L21/67706 ,  H01L21/67709 ,  H01L21/6773

    Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

    SEMICONDUCTOR PROCESS EQUIPMENT
    9.
    发明公开
    SEMICONDUCTOR PROCESS EQUIPMENT 审中-公开

    公开(公告)号：US20240153801A1

    公开(公告)日：2024-05-09

    申请号：US18141926

    申请日：2023-05-01

    Applicant: Applied Materials, Inc.

    Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Lakshmikanth Krishnamurthy SHIRAHATTI

    IPC: H01L21/677

    CPC classification number: H01L21/67706 ,  H01L21/67709 ,  H01L21/6773

    Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

    TRANSFER APPARATUS AND SUBSTRATE-SUPPORTING MEMBER
    10.
    发明申请
    TRANSFER APPARATUS AND SUBSTRATE-SUPPORTING MEMBER 有权

    公开(公告)号：US20220336248A1

    公开(公告)日：2022-10-20

    申请号：US17230775

    申请日：2021-04-14

    Applicant: Applied Materials, Inc.

    Inventor： Anubhav SRIVASTAVA ,  Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Srinivasa Rao YEDLA ,  Lakshmikanth Krishnamurthy SHIRAHATTI

    IPC: H01L21/683 ,  H01L21/677

    Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for processing substrates. More specifically, embodiments of the present disclosure relate to transfer apparatus and substrate-supporting members. In an embodiment, an apparatus for transferring a substrate is provided. The apparatus includes a hub and a plurality of transfer arms extending from the hub. The apparatus further includes a plurality of substrate-supporting members, wherein each of the transfer arms has a first end coupled to the hub and a second end coupled to a respective one of the plurality of substrate-supporting members. The apparatus further includes a first electrical interface connection for electrostatically chucking a substrate and located at a first position on each substrate-supporting member, and a second electrical interface connection for electrostatically chucking the substrate and located at a second position on each substrate-supporting member. Substrate processing modules are also described.

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