公开(公告)号：US12044821B2

公开(公告)日：2024-07-23

申请号：US16877158

申请日：2020-05-18

Applicant: Applied Materials, Inc.

Inventor： Sage Toko Garrett Doshay ,  Rutger Meyer Timmerman Thijssen ,  Ludovic Godet ,  Chien-An Chen ,  Pinkesh Rohit Shah

IPC: G03F7/00 ,  G02B1/00

CPC classification number: G02B1/002 ,  G03F7/0002

Abstract: Embodiments described herein relate to methods for fabricating optical devices. The methods described herein enable the fabrication of one or more optical devices on a substrate with apertures surrounding each of the optical devices having a plurality of structures. One embodiment of the methods described herein includes disposing an aperture material layer on a surface of a substrate, disposing a structure material layer over the apertures and the surface of the substrate, disposing a hardmask over the apertures and the structure material layer, disposing a patterned photoresist over the hardmask, the patterned photoresist defining exposed hardmask portions, removing the exposed hardmask portions to expose structure portions of the structure material layer, and removing the structure portions to form a plurality of structures between the apertures over regions of the surface of the substrate.

公开(公告)号：US11681083B2

公开(公告)日：2023-06-20

申请号：US16880846

申请日：2020-05-21

Applicant: Applied Materials, Inc.

Inventor： Sage Toko Garrett Doshay ,  Rutger Meyer Timmerman Thijssen ,  Ludovic Godet ,  Chien-An Chen ,  Pinkesh Rohit Shah

IPC: G02B5/22 ,  G02B5/20

CPC classification number: G02B5/20 ,  G02B2207/101

Abstract: Embodiments of the present disclosure relate to methods for fabricating optical devices. One embodiment of the method includes disposing a structure material layer on a surface of a substrate and disposing a patterned photoresist over the structure material layer. The patterned photoresist has at least one device portion and at least one auxiliary portion. Each device portion and each auxiliary portion exposes unmasked portions of the structure material layer. The unmasked portions of structure material layer corresponding to each device portion and each auxiliary portion are etched. The etching the unmasked portions forms at least one optical device having device structures corresponding to the unmasked portions of at least one device portion and at least one auxiliary region having auxiliary structures corresponding to the unmasked portions of at least one auxiliary portion.