公开(公告)号：US20230048337A1

公开(公告)日：2023-02-16

申请号：US17886748

申请日：2022-08-12

Applicant: Applied Materials, Inc.

Inventor： Robert A. Medure ,  Raechel Chu-Hui Tan ,  Changgong Wang ,  Yuanhong Guo ,  Sai Padhy ,  Ashley M. Okada ,  Kenneth Le ,  Atilla Kilicarslan ,  Dean C. Hruzek

IPC: F24F3/167 ,  F24F11/00 ,  F24F11/49 ,  F24F11/74

Abstract: Disclosed are implementations for minimizing substrate contamination during pressure changes in substrate processing systems. Over a duration of a pressure change (increase or decrease) in a chamber of a substrate processing system, a flow rate is adjusted multiple times to reduce occurrence of contaminant particles in an environment of the chamber. In some instances, the flow rate is changed continuously using at least one dynamic valve that enable continuous control over the pressure dynamics of the chamber.