公开(公告)号：US20230326780A1

公开(公告)日：2023-10-12

申请号：US18206931

申请日：2023-06-07

Applicant: Applied Materials, Inc.

Inventor： Wendell Glenn BOYD, Jr. ,  Stanley WU ,  Matthew BOYD

IPC: H01L21/683 ,  C23C16/458 ,  C23C16/30 ,  C23C16/02

CPC classification number: H01L21/6833 ,  C23C16/4583 ,  C23C16/308 ,  C23C16/0227

Abstract: A body of an electrostatic chuck comprises mesas disposed on a polished surface of the body. Each of the mesas comprises an adhesion layer disposed on the polished surface of the body, a transition layer disposed over the adhesion layer, and a coating layer disposed over the transition layer. The coating layer has a hardness of at least 14 GPa. The body further comprises a sidewall coating disposed over a sidewall of the body. A method for preparing the body comprises polishing the surface of the body and cleaning the polished surface. The method further comprises depositing the mesas by depositing the adhesion layer on the body, the transition layer over the adhesion layer, and the coating layer over the transition layer. Further, the method includes, polishing the mesas.

公开(公告)号：US20240420986A1

公开(公告)日：2024-12-19

申请号：US18814907

申请日：2024-08-26

Applicant: Applied Materials, Inc.

Inventor： Wendell Glenn BOYD, JR. ,  Stanley WU ,  Matthew BOYD

IPC: H01L21/683 ,  C23C16/02 ,  C23C16/30 ,  C23C16/458

Abstract: A body of an electrostatic chuck comprises mesas disposed on a polished surface of the body. Each of the mesas comprises an adhesion layer disposed on the polished surface of the body, a transition layer disposed over the adhesion layer, and a coating layer disposed over the transition layer. The coating layer has a hardness of at least 14 GPa. The body further comprises a sidewall coating disposed over a sidewall of the body. A method for preparing the body comprises polishing the surface of the body and cleaning the polished surface. The method further comprises depositing the mesas by depositing the adhesion layer on the body, the transition layer over the adhesion layer, and the coating layer over the transition layer. Further, the method includes, polishing the mesas.

公开(公告)号：US20200071823A1

公开(公告)日：2020-03-05

申请号：US16114558

申请日：2018-08-28

Applicant: Applied Materials, Inc.

Inventor： Ying MA ,  Yixi TIAN ,  Shih Chang CHEN ,  Jin SUN ,  Rodolfo PEREZ ,  Stanley WU

IPC: C23C16/458 ,  G01B21/30

Abstract: The present disclosure relates to a flexible support to aid in a measurement of flatness of a susceptor. The flexible support has a first support block having a substantially flat upper surface and a lower surface having a first aperture formed therein. The flexible support further has a second support block having a substantially flat lower surface and an upper surface having a second aperture formed therein. The flexible support further has a support pin configured to be receivable in the first aperture and the second aperture, the support pin configured to retain the first support block and the second support block in a spaced apart relation while allowing restricted motion of the first support block relative to the second support block via deformation of the support pin. The flexible support further has a guide disposed between the first support block and the second support block, the guide configured to allow the first support block and the second support block to move axially relative to the guide.

公开(公告)号：US20230238267A1

公开(公告)日：2023-07-27

申请号：US17584503

申请日：2022-01-26

Applicant: Applied Materials, Inc.

Inventor： Ramesh GOPALAN ,  Robert Toshiharu HIRAHARA ,  Stanley WU ,  Michael Prestoza DECENA ,  Wendell BOYD ,  Siamak SALIMIAN ,  Thomas BREZOCZKY

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/304

CPC classification number: H01L21/6833 ,  H01L21/68757 ,  H01L21/304

Abstract: Methods and apparatus reduce chucking abnormalities for electrostatic chucks by ensuring proper planarizing of ceramic surfaces of the electrostatic chuck. In some embodiments, a method for planarizing an upper ceramic surface of an electrostatic chuck assembly may comprise placing the electrostatic chuck assembly in a first planarizing apparatus, altering an upper ceramic surface of the electrostatic chuck assembly, and halting the altering of the upper ceramic surface of the electrostatic chuck assembly when an Sa parameter is less than approximately 0.1 microns, an Sdr parameter is less than approximately 2.5 percent, an Sz parameter is less than approximately 10 microns for any given area of approximately 10 mm2 of the upper ceramic surface, or a pit-porosity depth parameter of greater than 1 micron is less than approximately 0.1 percent of area of the upper ceramic surface.

公开(公告)号：US20220270907A1

公开(公告)日：2022-08-25

申请号：US17183179

申请日：2021-02-23

Applicant: Applied Materials, Inc.

Inventor： Wendell Glenn BOYD, JR. ,  Stanley WU ,  Matthew BOYD

IPC: H01L21/683 ,  C23C16/02 ,  C23C16/30 ,  C23C16/458

Abstract: A body of an electrostatic chuck comprises mesas disposed on a polished surface of the body. Each of the mesas comprises an adhesion layer disposed on the polished surface of the body, a transition layer disposed over the adhesion layer, and a coating layer disposed over the transition layer. The coating layer has a hardness of at least 14 Gpa. The body further comprises a sidewall coating disposed over a sidewall of the body. A method for preparing the body comprises polishing the surface of the body and cleaning the polished surface. The method further comprises depositing the mesas by depositing the adhesion layer on the body, the transition layer over the adhesion layer, and the coating layer over the transition layer. Further, the method includes, polishing the mesas.

公开(公告)号：US20170162422A1

公开(公告)日：2017-06-08

申请号：US15371849

申请日：2016-12-07

Applicant: Applied Materials, Inc.

Inventor： Govinda RAJ ,  Hanish Kumar PANAVALAPPIL KUMARANKUTTY ,  Stanley WU

IPC: H01L21/687

CPC classification number: H01L21/68721 ,  H01L21/68735 ,  H01L21/68757

Abstract: The present disclosure generally relates to generally relates to equipment for performing semiconductor device fabrication, and more particularly, to a cover ring for partially covering a surface of a substrate support in high-density plasma chemical vapor deposition processing. In one embodiment, the cover ring may include an annular body, an inner support block with a beveled first edge for stability, one or more thermal breaks to increase thermal movement towards the outer diameter, a rounded shoulder to prevent particle deposition, an outer lip configured to a substrate support pedestal, a vertical appendage to support the substrate, and a thermally conductive coating disposed on the annular ring to direct thermal conductivity towards the outer edge of the ring and prevent particle accumulation.

公开(公告)号：US20200370174A1

公开(公告)日：2020-11-26

申请号：US16806656

申请日：2020-03-02

Applicant: Applied Materials, Inc.

Inventor： Shuran SHENG ,  Lin ZHANG ,  Jiyong HUANG ,  Joseph C. WERNER ,  Stanley WU ,  Mahesh Adinath KANAWADE ,  Yikai CHEN ,  Yixing LIN ,  Ying MA

IPC: C23C16/44 ,  C01F17/265

Abstract: Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.

公开(公告)号：US20190043744A1

公开(公告)日：2019-02-07

申请号：US16046105

申请日：2018-07-26

Applicant: Applied Materials, Inc.

Inventor： Tom K. CHO ,  Ali SALEHPOUR ,  Stanley WU ,  Ying MA

IPC: H01L21/677 ,  H01L21/67

Abstract: A method and apparatus for monitoring substrate lift pin operation is disclosed and includes a support pedestal for a vacuum chamber, the support pedestal comprising a body having a plurality of openings formed between two major sides of the body, and a substrate support device disposed in each of the plurality of openings, each of the support devices comprising a housing disposed in the body, the housing having a bore formed therethrough, and a support pin disposed in the bore, wherein the body includes a monitoring device positioned proximal to the support pins of each of the substrate support devices.

公开(公告)号：US20170191161A1

公开(公告)日：2017-07-06

申请号：US15141443

申请日：2016-04-28

Applicant: Applied Materials, Inc.

Inventor： Govinda RAJ ,  Hanish KUMAR ,  Lin ZHANG ,  Stanley WU

IPC: C23C16/455 ,  C23C16/44 ,  H01J37/32

Abstract: Techniques are disclosed for methods and apparatuses for reducing particle contamination formation in a high temperature processing chamber with a cooled gas feed block. The cooled gas feed has a body. The body has a main center portion having a top surface and a bottom surface. The body also has a flange extending outward from the bottom surface of the main center portion. A gas channel is disposed through the body. The gas channel has an inlet formed in the top surface of the main center portion and an outlet formed in the bottom surface of the main center portion. The body also has a center coolant channel. The center coolant channel has a first portion having an inlet formed in the top surface of the main center portion, and a second portion coupled to the first portion, the second portion having an outlet formed a sidewall of the flange.

公开(公告)号：US20170152968A1

公开(公告)日：2017-06-01

申请号：US15110714

申请日：2016-04-06

Applicant: Applied Materials, Inc.

Inventor： Govinda RAJ ,  Hanish KUMAR ,  Lin ZHANG ,  Stanley WU

IPC: F16K41/10 ,  H01J37/32 ,  F16L11/15 ,  H01L21/687

CPC classification number: F16K41/10 ,  C23C16/4404 ,  F16L11/15 ,  H01J37/32477 ,  H01J37/32495 ,  H01L21/68757 ,  H01L21/68792

Abstract: Implementations described herein protect a chamber components from corrosive cleaning gases used at high temperatures. In one embodiment, a chamber component includes at least a bellows that includes a top mounting flange coupled to a bottom mounting flange by a tubular accordion structure. A coating is disposed on an exterior surface of at least the tubular accordion structure. The coating includes of at least one of polytetrafluoroethylene, parylene C, parylene D, diamond-like carbon (DLC), yttria stabilized zirconia, nickel, alumina, or aluminum silicon magnesium yttrium oxygen compound. In one embodiment, the chamber component is a valve having an internal bellows.