公开(公告)号：US10418148B2

公开(公告)日：2019-09-17

申请号：US15620028

申请日：2017-06-12

Applicant: Arlon LLC

Inventor： Daniel Chang ,  Sam Najjar

IPC: H01B3/40 ,  C08J5/24 ,  C08L79/04 ,  C08K3/36 ,  H05K1/03 ,  H05K1/02 ,  C08K5/523

Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.

公开(公告)号：US20170287589A1

公开(公告)日：2017-10-05

申请号：US15620028

申请日：2017-06-12

Applicant: Arlon LLC

Inventor： Daniel Chang ,  Sam Najjar

IPC: H01B3/40 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01B3/40 ,  C08J5/24 ,  C08J2379/04 ,  C08K3/36 ,  C08K5/523 ,  C08L79/04 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/0353 ,  H05K1/0373 ,  H05K2201/012 ,  Y10T428/249955 ,  Y10T428/31511 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31931 ,  Y10T442/20 ,  Y10T442/2475

Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.