公开(公告)号：US20220192005A1

公开(公告)日：2022-06-16

申请号：US17123517

申请日：2020-12-16

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Jason M. Bugeau-Medas ,  Scott P. Rogers ,  Eric A. Skogsholm

IPC: H05K1/02 ,  H05K3/28

Abstract: An electronic module utilizing a bathtub heatsink and single-cover design to provide improved thermal management and fault isolation while minimizing cost and complexity. The electronic module may also provide for better galvanic corrosion prevention through the utilization of a single finish on the components thereof. Further provided may be an electronic module design utilizing a single set of fasteners, which may further reduce assembly cost and complexity while further providing increase galvanic corrosion prevention.