公开(公告)号：US20210370644A1

公开(公告)日：2021-12-02

申请号：US16495171

申请日：2018-03-12

Applicant: BASF SE

Inventor： Philippe Desbois ,  Josef R. Wuensch

IPC: B32B15/088 ,  C08G69/16 ,  C08G69/28 ,  B32B15/18 ,  B32B15/20 ,  B32B37/06 ,  B32B37/15 ,  B32B27/20 ,  B32B27/34

Abstract: The present invention relates to a laminate comprising at least one first layer of at least one first metal and at least one further layer of a polyamide composition (PC). The present invention further relates to a process for producing the laminate according to the invention.

公开(公告)号：US11964449B2

公开(公告)日：2024-04-23

申请号：US16495171

申请日：2018-03-12

Applicant: BASF SE

Inventor： Philippe Desbois ,  Josef R. Wuensch

IPC: B32B15/088 ,  B32B15/18 ,  B32B15/20 ,  B32B27/20 ,  B32B27/34 ,  B32B37/06 ,  B32B37/15 ,  C08G69/16 ,  C08G69/28

CPC classification number: B32B15/088 ,  B32B15/18 ,  B32B15/20 ,  B32B27/20 ,  B32B27/34 ,  B32B37/06 ,  B32B37/15 ,  C08G69/16 ,  C08G69/28 ,  B32B2307/732

Abstract: The present invention relates to a laminate comprising at least one first layer of at least one first metal and at least one further layer of a polyamide composition (PC). The present invention further relates to a process for producing the laminate according to the invention.