公开(公告)号：US20240045160A1

公开(公告)日：2024-02-08

申请号：US18363984

申请日：2023-08-02

Applicant: BEIHANG UNIVERSITY

Inventor： Chen XIAO ,  Rui XU ,  Boyu ZHANG ,  Xiangyu ZHENG ,  Wenlong CAI ,  Jiaqi WEI ,  Weisheng ZHAO

IPC: G02B6/42

CPC classification number: G02B6/4283 ,  G02B6/4279

Abstract: Disclosed are a low-loss coplanar waveguide bonding structure and a manufacturing method thereof, relating to the technical field of semiconductor. The low-loss coplanar waveguide bonding structure includes: a first coplanar waveguide on a first substrate, a second coplanar waveguide on a second substrate and having a same structure as the first coplanar waveguide, and a plurality of two-dimensional heterostructures connecting conductors of the first coplanar waveguide and the second coplanar waveguide in a one-to-one correspondence, where the two-dimensional heterostructures includes: a two-dimensional conductive material layer for signal transmission and a two-dimensional dielectric material layer under the two-dimensional conductive material layer.