公开(公告)号：US20240312666A1

公开(公告)日：2024-09-19

申请号：US17995576

申请日：2021-11-23

Applicant: BEIJING DREAM INK TECHNOLOGIES CO., LTD.

Inventor： Zhongwei REN ,  Jiameng KANG

IPC: H01B1/22

CPC classification number: H01B1/22

Abstract: The present application provides a conductive paste and an electronic device and relates to a technical field of new material. The conductive paste provided by the present application includes, 5%-20% by weight of a resin, 5%-20% by weight of a solvent, and 70%-90% by weight of a conductive filler; the conductive filler includes a first conductive filler, a second conductive filler, and a third conductive filler, and the first conductive filler is configured to increase a filling amount of the conductive filler, the second conductive filler is configured to reduce a sintering temperature of the conductive filler, and the third conductive filler is configured to slow erosion to the conductive filler by a soldering tin during a soldering process. By adopting the technical solution of the present application, soldering can be performed directly with soldering tin wire.

公开(公告)号：US20230162882A1

公开(公告)日：2023-05-25

申请号：US17776739

申请日：2021-10-20

Applicant: BEIJING DREAM INK TECHNOLOGIES CO., LTD.

Inventor： Zhenlong MEN ,  Zhongwei REN ,  Jiameng KANG

IPC: H01B1/22 ,  B22F1/103

CPC classification number: H01B1/22 ,  B22F1/103 ,  B22F2201/20 ,  B22F2201/11 ,  B22F2201/02

Abstract: A method for prepares low melting point metal particles, a conductive paste and a method for preparing the conductive paste, and relates to the technical field of functional materials. The method for preparing low melting point metal particles includes providing an organic resin carrier having fluidity, adding a low melting point metal material and the organic resin carrier into a sealed container for a vacuuming operation or filling a protective gas, making a temperature in the sealed container higher than the melting point of the low melting point metal and performing dispersion by stirring, and lowering the temperature, after performing the dispersion, to be below the melting point of the low melting point metal with continuous stirring during a cooling process to obtain low melting point metal particles dispersed in the organic resin carrier. Low melting point metal particles can be effectively prepared.

公开(公告)号：US20240244745A1

公开(公告)日：2024-07-18

申请号：US17995477

申请日：2022-03-01

Applicant: BEIJING DREAM INK TECHNOLOGIES CO., LTD.

Inventor： Zhongwei REN ,  Jiangchuan WANG ,  Jiameng KANG

IPC: H05K1/09 ,  H05K3/22

CPC classification number: H05K1/092 ,  H05K3/227 ,  H05K2203/0766

Abstract: The present disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a substrate and a conductive structure disposed on the substrate, the conductive structure includes a conductive pattern made of a conductive paste and positive ions, the conductive pattern includes conductive particles and a resin, the positive ions are attached to the resin among the conductive particles. The technical solutions of the present disclosure are able to make the resistance of the conductive structure independent of drying and curing process without changing the existing conductive paste material system.