公开(公告)号：US10127865B2

公开(公告)日：2018-11-13

申请号：US15000012

申请日：2016-01-18

Applicant: BENQ CORPORATION

Inventor： Ho-Shih Wu ,  Chih-Ren Chen

IPC: G01N21/59 ,  G09G3/34 ,  G01J1/02

Abstract: A sensing device for sensing a backlight density of a panel module is disclosed. The panel module includes a panel, a back plate and a holding frame. The back plate has an opening formed thereon and is for installing the panel onto the holding frame. The sensing device includes a sensor module and a base. The sensor module is for sensing a light projected via the opening and generated by the panel. The base is disposed between the back plate and the holding frame. The base includes a main body and a resilient structure. The main body is for containing the sensor module. The resilient structure extends from the main body and resiliently abuts against the holding frame. The resilient structure presses the main body onto the back plate when resilient abutting against the holding frame, such that the back plate and the main body cooperatively covers the sensor module.

公开(公告)号：US20160216206A1

公开(公告)日：2016-07-28

申请号：US15000012

申请日：2016-01-18

Applicant: BENQ CORPORATION

Inventor： Ho-Shih Wu ,  Chih-Ren Chen

IPC: G01N21/59

CPC classification number: G09G3/3406 ,  G01J1/02 ,  G01J1/0403 ,  G01J2001/4247 ,  G02F1/13318 ,  G02F1/1336

Abstract: A sensing device for sensing a backlight density of a panel module is disclosed. The panel module includes a panel, a back plate and a holding frame. The back plate has an opening formed thereon and is for installing the panel onto the holding frame. The sensing device includes a sensor module and a base. The sensor module is for sensing a light projected via the opening and generated by the panel. The base is disposed between the back plate and the holding frame. The base includes a main body and a resilient structure. The main body is for containing the sensor module. The resilient structure extends from the main body and resiliently abuts against the holding frame. The resilient structure presses the main body onto the holding frame when resilient abutting against the holding frame, such that the back plate and the main body cooperatively covers the sensor module.

Abstract translation: 公开了用于感测面板模块的背光密度的感测装置。 面板模块包括面板，背板和保持框架。 背板具有形成在其上的开口，用于将面板安装到保持框架上。 感测装置包括传感器模块和基座。 传感器模块用于感测经由开口投射并由面板产生的光。 底座设置在后板和保持架之间。 基座包括主体和弹性结构。 主体用于容纳传感器模块。 弹性结构从主体延伸并弹性地抵靠保持框架。 当弹性抵靠保持框架时，弹性结构将主体按压到保持框架上，使得背板和主体协同地覆盖传感器模块。