Methods for inspecting semiconductor wafers

    公开(公告)号:US10241051B2

    公开(公告)日:2019-03-26

    申请号:US15851993

    申请日:2017-12-22

    Abstract: Methods and systems are presented for analyzing semiconductor materials as they progress along a production line, using photoluminescence images acquired using line-scanning techniques. The photoluminescence images can be analyzed to obtain spatially resolved information on one or more properties of said material, such as lateral charge carrier transport, defects and the presence of cracks. In one preferred embodiment the methods and systems are used to obtain series resistance images of silicon photovoltaic cells without making electrical contact with the sample cell.

    METHODS FOR INSPECTING SEMICONDUCTOR WAFERS
    3.
    发明申请
    METHODS FOR INSPECTING SEMICONDUCTOR WAFERS 有权
    检测半导体波形的方法

    公开(公告)号:US20150168303A1

    公开(公告)日:2015-06-18

    申请号:US14411915

    申请日:2013-07-05

    Abstract: Methods and systems are presented for analysing semiconductor materials as they progress along a production line, using photoluminescence images acquired using line-scanning techniques. The photoluminescence images can be analysed to obtain spatially resolved information on one or more properties of said material, such as lateral charge carrier transport, defects and the presence of cracks. In one preferred embodiment the methods and systems are used to obtain series resistance images of silicon photovoltaic cells without making electrical contact with the sample cell.

    Abstract translation: 介绍了使用线扫描技术获得的光致发光图像,分析半导体材料在生产线上进行分析的方法和系统。 可以分析光致发光图像以获得关于所述材料的一种或多种性质的空间分辨信息,例如横向载流子传输,缺陷和裂纹的存在。 在一个优选实施例中,方法和系统用于获得硅光伏电池的串联电阻图像,而不与样品池电接触。

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