公开(公告)号：US3336898A

公开(公告)日：1967-08-22

申请号：US23816562

申请日：1962-11-16

Applicant: BURROUGHS CORP

Inventor： SIMMONS JOHN G ,  MOISTER JR DOUGLAS E ,  STARR JR DAVID A

IPC: C23C14/04 ,  C23C14/22

CPC classification number: C23C14/042 ,  C23C14/22

公开(公告)号：US3926360A

公开(公告)日：1975-12-16

申请号：US47369874

申请日：1974-05-28

Applicant: BURROUGHS CORP

Inventor： MOISTER JR DOUGLAS E

IPC: B23K1/005 ,  H05K3/34 ,  H05K3/36 ,  H01R43/00

CPC classification number: H01R12/62 ,  B23K1/0053 ,  B23K2201/42 ,  H05K3/3494 ,  H05K3/363 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/0455

Abstract: An improved method for soldering the terminals of a rigid printed circuit board to those of a flexible printed circuit board, such method comprising the steps of focusing a radiant heating source upon each of a plurality of solder globules deposited in a like number of through holes in the terminals of the rigid printed circuit board for controlling of the capillary flow of the molten solder radially from the through holes to form solder points of controlled depth and pattern between the terminals of the boards.