公开(公告)号：US20240003826A1

公开(公告)日：2024-01-04

申请号：US18216162

申请日：2023-06-29

Applicant: CAMTEK LTD

Inventor： Carmel Yehuda DRILLMAN ,  Moshe EDRI ,  Menachem REGENSBURGER ,  Baheej BATHISH ,  Mordi DAHAN

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9503 ,  G01N21/8806 ,  G01N2021/8825 ,  H01L22/12

Abstract: A semiconductor inspection tool system is disclosed. The system comprises a first illumination setup for generating at least one first illumination radiation and for directing the at least one first illumination radiation to at least one bonding region non-filled volume formed between two layers of a multi-layer stack. The system also comprises a second illumination setup being for generating at least one second illumination radiation and for directing the at least one second illumination radiation at multi-layer stack edges. The second illumination radiation is configured for illuminating at least a normal edge of at least two layers, the second illumination setup has different radiation parameters than the first illumination setup. The system further includes a bonding region sensor unit for collecting reflected electromagnetic radiation from a bonding region volume and generating at least one sensing data being indicative of the bonding region.

公开(公告)号：US20240355083A1

公开(公告)日：2024-10-24

申请号：US18644312

申请日：2024-04-24

Applicant: CAMTEK LTD

Inventor： Carmel Yehuda DRILLMAN ,  Mordi DAHAN ,  Moshe EDRI ,  Ohad SHIMON ,  Shimon KOREN ,  Gil PERLBERG

IPC: G06V10/145 ,  G01N21/95 ,  G06T7/00 ,  G06T7/13 ,  H04N23/56

CPC classification number: G06V10/145 ,  G01N21/9503 ,  G06T7/0004 ,  G06T7/13 ,  H04N23/56 ,  G06T2207/10152 ,  G06T2207/30148

Abstract: An inspection system and method are presented for edge and bevel inspection of a semiconductor structure using and an optical system defining: a tangential imaging providing back-light tangential illumination propagating along a tangential illumination path with respect to a contour outline of a contour region of an edge of the structure and substantially along a detection path of a tangential imaging sensor unit which detects at least a part of said back-light tangential illumination and generates image data indicative of a tangential image of the contour outline to enable detection of defect data of the edge, and at least dark-field imaging setup directing dark-field illumination towards the contour region along at least one dark-field illumination path and providing collection of scattering of a response of the contour region to the dark-field illumination, to enable detection of a dark-field image indicative of location of defects along said profile of the edge.