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公开(公告)号:US20240134235A1
公开(公告)日:2024-04-25
申请号:US18546552
申请日:2022-02-22
Applicant: CARLEX GLASS AMERICA, LLC
Inventor: Wladislaw BRONSTEIN , Jean-Marc SOL
IPC: G02F1/1343 , B32B17/10 , G02F1/1334
CPC classification number: G02F1/134309 , B32B17/10036 , B32B17/10504 , B32B17/10532 , B32B17/10605 , B32B17/10761 , B32B17/10788 , G02F1/1334 , B60J1/001
Abstract: A switchable film sequentially includes a first substrate; a first conductive layer; a switchable material layer; a second conductive layer; and a second substrate. The first substrate includes a first cut out portion wherein the first cut out portion aligns entirely with the second substrate. A first busbar is formed on the first conductive layer on the first substrate and a second busbar is formed on the second conductive layer on the second substrate within the first cut out portion of the first substrate. A first barrier is positioned around the first cut out portion of the first substrate.
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公开(公告)号:US20240231159A9
公开(公告)日:2024-07-11
申请号:US18546552
申请日:2022-02-22
Applicant: CARLEX GLASS AMERICA, LLC
Inventor: Wladislaw BRONSTEIN , Jean-Marc SOL
IPC: G02F1/1343 , B32B17/10 , G02F1/1334
CPC classification number: G02F1/134309 , B32B17/10036 , B32B17/10504 , B32B17/10532 , B32B17/10605 , B32B17/10761 , B32B17/10788 , G02F1/1334 , B60J1/001
Abstract: A switchable film sequentially includes a first substrate; a first conductive layer; a switchable material layer; a second conductive layer; and a second substrate. The first substrate includes a first cut out portion wherein the first cut out portion aligns entirely with the second substrate. A first busbar is formed on the first conductive layer on the first substrate and a second busbar is formed on the second conductive layer on the second substrate within the first cut out portion of the first substrate. A first barrier is positioned around the first cut out portion of the first substrate.
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公开(公告)号:US20230348761A1
公开(公告)日:2023-11-02
申请号:US18014086
申请日:2021-07-01
Applicant: CARLEX GLASS AMERICA, LLC
Inventor: Wladislaw BRONSTEIN , Olivier FARREYROL , Jacob Daniel RIGELMAN,
IPC: C09J9/02 , H01L21/683
CPC classification number: C09J9/02 , H01L21/6836 , C09J2203/326
Abstract: A glass product includes a glazing having a connectable material with a connecting surface on the glazing, a connector including a housing, and a connector plate within the housing, and a conductive material within the housing; at least part of the conductive material being positioned between the connector plate and the connecting surface.
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公开(公告)号:US20230276542A1
公开(公告)日:2023-08-31
申请号:US18014082
申请日:2021-07-01
Applicant: CARLEX GLASS AMERICA, LLC
Inventor: Wladislaw BRONSTEIN , Olivier FARREYROL , Jacob Daniel RIGELMAN , Michael BARD
Abstract: A glass product, comprising: a glazing having a connectable material with a connecting surface thereon; a connector over the connecting surface including a housing and a connector plate within the housing; and a conductive material within the housing, wherein the connector plate is spring loaded.
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公开(公告)号:US20230121640A1
公开(公告)日:2023-04-20
申请号:US17914055
申请日:2021-03-26
Applicant: CARLEX GLASS AMERICA, LLC
Inventor: Wladislaw BRONSTEIN , Olivier FARREYROL , Jean-Baptiste POUILLON , Michael BARD , Yu MATSUDA , Emily Anne CURTIS , Linda Anne LEONARD
Abstract: Disclosed herein is a laminated glazing having an electrically connectable layer, comprising: first and second glass substrates; an electrically connectable layer; interlayers rendering the electrically connectable layer positioned between interlayers; and a connection wire having first and second connection ends and a main portion positioned between the first and second connection ends. The first connection end of the connection wire is electrically connected to the electrically connectable layer, whereas the main portion of the connection wire is positioned within the interlayers.
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公开(公告)号:US20220219254A1
公开(公告)日:2022-07-14
申请号:US17573797
申请日:2022-01-12
Applicant: CARLEX GLASS AMERICA, LLC
Inventor: Wladislaw BRONSTEIN , Jean-Marc SOL , Norihiko KATO
Abstract: A method of connection to a conductive material for, such as, a switchable film, includes steps of providing a switchable film having a first substrate, a first conductive layer, a switchable layer, a second conductive layer, and a second substrate; applying a solder material to the first conductive layer with ultrasonic application to provide a first busbar; and applying the solder material to the second conductive layer with ultrasonic application to provide a second busbar. The busbars are to be connected to connectors.
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