METHOD OF CONNECTION TO A CONDUCTIVE MATERIAL

    公开(公告)号:US20220219254A1

    公开(公告)日:2022-07-14

    申请号:US17573797

    申请日:2022-01-12

    Abstract: A method of connection to a conductive material for, such as, a switchable film, includes steps of providing a switchable film having a first substrate, a first conductive layer, a switchable layer, a second conductive layer, and a second substrate; applying a solder material to the first conductive layer with ultrasonic application to provide a first busbar; and applying the solder material to the second conductive layer with ultrasonic application to provide a second busbar. The busbars are to be connected to connectors.

Patent Agency Ranking