公开(公告)号：US20170211791A1

公开(公告)日：2017-07-27

申请号：US15039605

申请日：2014-11-26

Applicant: CERAMTEC GMBH

Inventor： Marco HEINRICH ,  Anton GSCHWANDLER

IPC: F21V23/00 ,  F21V29/85 ,  F21V3/04 ,  H05K1/18 ,  F21V23/06

CPC classification number: F21V23/005 ,  F21K9/20 ,  F21V3/062 ,  F21V23/001 ,  F21V23/06 ,  F21V29/86 ,  F21V31/00 ,  F21V31/005 ,  F21V31/04 ,  F21Y2103/10 ,  F21Y2103/30 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10356

Abstract: The invention relates to an LED module having a support body, on the surface of which metallization regions forming a circuit board are arranged and on which LEDs are mounted. In order that the LED module is immediately ready for use, i.e. can be connected directly to a power supply, according to the invention, it is proposed that, in addition to the LEDs, the driver modules thereof are also mounted on the metallization regions and at least the LEDs together with the driver modules are covered by a light-transmitting material, electrical connecting elements are connected to the LEDs or driver modules and are fed out of the translucent material.