公开(公告)号：US11930600B2

公开(公告)日：2024-03-12

申请号：US17523266

申请日：2021-11-10

Applicant: CKD CORPORATION

Inventor： Takayuki Shinyama ,  Tsuyoshi Ohyama ,  Norihiko Sakaida

IPC: G01B11/25 ,  G01B11/06 ,  G01N21/956 ,  H05K13/08 ,  G01B11/00

CPC classification number: H05K13/0817 ,  G01B11/0608 ,  G01B11/2513 ,  G01N21/95684 ,  H05K13/083 ,  G01B11/002 ,  G01N2021/95646

Abstract: A three-dimensional measurement apparatus measures measurement targets placed in a target measurement area on a measurement object. The apparatus includes: a measurement module that: is positioned with respect to the target measurement area, and includes: a first irradiator that irradiates the target measurement area with predetermined light for height measurement; a second irradiator that irradiates the target measurement area with predetermined patterned light for three-dimensional measurement; and an imaging device that takes an image of the target measurement area; and a control device that moves the measurement module in a height direction and successively positions the measurement module at a predetermined height position determined by mapping, and performs, based on image data taken by irradiating the target measurement area with predetermined patterned light, three-dimensional measurement to the measurement targets at the predetermined height position.

公开(公告)号：US20230014796A1

公开(公告)日：2023-01-19

申请号：US17953888

申请日：2022-09-27

Applicant: CKD CORPORATION

Inventor： Kazuyoshi Kikuchi ,  Takayuki Shinyama ,  Tsuyoshi Ohyama ,  Norihiko Sakaida

IPC: H05K3/34 ,  B41F15/08 ,  G01N21/89

Abstract: A screen mask inspection device inspects a screen mask including a screen opening that forms a printing pattern, and includes: an inspection control device that detects solder position information of a solder paste printed on a substrate via the screen opening, and based on the solder position information, determines whether a quality of printing using the screen mask is good or bad, the solder position information being based on an amount of positional misalignment of the solder paste actually printed on the substrate relative to a predetermined reference position.

公开(公告)号：US20220071073A1

公开(公告)日：2022-03-03

申请号：US17523266

申请日：2021-11-10

Applicant: CKD CORPORATION

Inventor： Takayuki Shinyama ,  Tsuyoshi Ohyama ,  Norihiko Sakaida

IPC: H05K13/08 ,  G01B11/06 ,  G01B11/25 ,  G01N21/956

Abstract: A three-dimensional measurement apparatus measures measurement targets placed in a target measurement area on a measurement object. The apparatus includes: a measurement module that: is positioned with respect to the target measurement area, and includes: a first irradiator that irradiates the target measurement area with predetermined light for height measurement; a second irradiator that irradiates the target measurement area with predetermined patterned light for three-dimensional measurement; and an imaging device that takes an image of the target measurement area; and a control device that moves the measurement module in a height direction and successively positions the measurement module at a predetermined height position determined by mapping, and performs, based on image data taken by irradiating the target measurement area with predetermined patterned light, three-dimensional measurement to the measurement targets at the predetermined height position.