公开(公告)号：US11856730B2

公开(公告)日：2023-12-26

申请号：US17467284

申请日：2021-09-06

Applicant: CMOTION TECHNOLOGIES LIMITED

Inventor： Changjiang Ge ,  Minghui Sun ,  Hao Peng ,  Bin Yang ,  Zhenhui Li

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20254 ,  H05K7/20718 ,  H05K7/20781

Abstract: The present invention provides a liquid-cooled integrated cabinet, which belongs to the technical field of servers, and comprises a main body. A power distribution module is provided at the upper end of the main body, and multiple computing power modules which constitute a computing power center are parallelly provided on one side of the lower end of the main body; cooling fans stacked on top and bottom in multiple layers are arranged on the other side thereof; the computing power module is cooled by a liquid-cooled module, and the liquid-cooled module is a front and rear drawing structure relative to the main body. The cooling fan bears 8%-12% of the heat dissipation capacity. A cold plate shell in the liquid-cooled module contacts and conducts heat with a chip in the computing power module. The front end of the main body is provided with a hose for cooling medium to circulate; a liquid-cooled module corresponds to a hose; cooling medium flows through the hose and the liquid-cooled module, and then cools down the computing power module. The liquid-cooled integrated cabinet of the present invention is high in heat dissipation efficiency and compact in structure.

公开(公告)号：USD995565S1

公开(公告)日：2023-08-15

申请号：US29807253

申请日：2021-09-10

Applicant: CMOTION TECHNOLOGIES LIMITED

Designer： Changjiang Ge ,  Minghui Sun ,  Hao Peng ,  Bin Yang ,  Zhenhui Li

Abstract: FIG. 1 is a perspective view of a liquid cooling pump set showing our new design;
FIG. 2 is a front view of the liquid cooling pump set of FIG. 1;
FIG. 3 is a rear view of the liquid cooling pump set of FIG. 1;
FIG. 4 is a left side view of the liquid cooling pump set of FIG. 1;
FIG. 5 is a right side view of the liquid cooling pump set of FIG. 1;
FIG. 6 is a top view of the liquid cooling pump set of FIG. 1; and,
FIG. 7 is a bottom view of the liquid cooling pump set of FIG. 1.

公开(公告)号：US12050496B2

公开(公告)日：2024-07-30

申请号：US17398008

申请日：2021-08-10

Applicant: CMOTION TECHNOLOGIES LIMITED

Inventor： Bin Yang

IPC: G06F1/26 ,  G06F1/18 ,  G06F1/20 ,  H05K7/14 ,  H05K7/20

CPC classification number: G06F1/26 ,  G06F1/181 ,  G06F1/183 ,  G06F1/189 ,  G06F1/20 ,  H05K7/1492 ,  H05K7/20818 ,  G06F2200/201

Abstract: The disclosure discloses a server, which includes a housing, a plurality of hash boards, a control module, a power supply module, an electrical connection board and a heat dissipation nodule, wherein a second accommodation space is suitable for assembling a power supply module. A plurality of hash boards are slidably arranged in a first accommodation space of the housing. The control module is slidably arranged in a third accommodation space of the housing, and the power module is slidably arranged in a fourth accommodation space of the housing. The hash board, the power module, the control module and the power supply module are respectively connected with the electrical connection board. The power supply module supplies power to the hash board through the electrical connection board, and the power supply module supplies power to the control module through the electrical connection board.