公开(公告)号：US20220106218A1

公开(公告)日：2022-04-07

申请号：US17491930

申请日：2021-10-01

Applicant: CORNING INCORPORATED

Inventor： XINYU CAO ,  LING CHEN ,  WANGHUI CHEN ,  JIANGWEI FENG ,  WILLIAM JOSEPH HURLEY ,  WEIRONG JIANG ,  PETER JOSEPH LEZZI ,  SAMUEL ODEI OWUSU

IPC: C03B27/02 ,  C03C15/00 ,  C03C23/00

Abstract: Methods of forming a foldable substrate comprise providing a glass-based substrate comprising a first compressive stress region extending to an existing first depth of compression from an existing first major surface. Methods comprise contacting the existing first major surface with a solution to remove an outer compressive layer of the first compressive stress region to form a new first major surface. The outer compressive layer ranges from about 0.05 micrometers to about 5 micrometers. The solution can comprise a first temperature in a range from about 60° C. to about 120° C. The solution can comprise an alkaline solution comprising about 10 wt % or more of a hydroxide-containing base. In aspects, the method can comprise one or more of: attaching an adhesive layer to the new first major surface, attaching a display device to the new first major surface, or disposing a coating over the new first major surface.