FOLDABLE ELECTRONIC DEVICE MODULES WITH IMPACT AND BEND RESISTANCE

    公开(公告)号:US20200287156A1

    公开(公告)日:2020-09-10

    申请号:US16754581

    申请日:2018-10-09

    Abstract: A foldable electronic device module includes: a glass-containing cover element having a thickness from about (25) μm to about (200) μm, an elastic modulus from about (20) to (140) GPa, and first and second primary surfaces; a stack comprising: (a) an interlayer having an elastic modulus from about (0.01) to (10) GPa and a thickness from about 50 to (200) μm, and (b) a flexible substrate having a thickness from about (100) to (200) μm; and a first adhesive joining the stack to the cover element, and comprising an elastic modulus from about (0.001) to (10) GPa and a thickness from about (5) to (25) μm. Further, the module comprises an impact resistance characterized by tensile stresses of less than about (4100) MPa and less than about (8300) MPa at the first and second primary surfaces of the cover element, respectively, upon an impact in a Pen Drop Test.

    FOLDABLE APPARATUS
    3.
    发明公开
    FOLDABLE APPARATUS 审中-公开

    公开(公告)号:US20230364888A1

    公开(公告)日:2023-11-16

    申请号:US18025994

    申请日:2021-09-13

    Abstract: Foldable apparatus comprise a plurality of first portions and at least one second portion positioned between a corresponding adjacent pair of first portions of the plurality of first portions. Each second portion of the at least one second portion comprises a maximum Young’s modulus ranging from about 500 times to about 500,000 times less than a minimum Young’s modulus of the corresponding adjacent pair of first portions. In some embodiments, the at least one second portion comprises at least five second portions. In some embodiments, each second portion of the at least one second portion comprises a thickness ranging from about 10 micrometers to about 250 micrometers. In some embodiments, each first portion comprises a first neutral plane and each second portion comprises a second neutral plane. In some embodiments, an apparatus bend force ranges from about 0.5 times to about 1 times a total bend force.

    FOLDABLE SUBSTRATES AND METHODS OF MAKING

    公开(公告)号:US20250136501A1

    公开(公告)日:2025-05-01

    申请号:US18689537

    申请日:2022-09-07

    Abstract: Foldable substrates comprise a substrate thickness from about 80 micrometers to about 2 millimeters. Foldable substrates comprise a first portion, a second portion, and a central portion positioned therebetween. The central portion comprises a central thickness from about 25 micrometers to about 80 micrometers defined between a first central surface area and a second central surface area. A central total thickness variation of the central portion over the first central surface area is less than or equal to 10 micrometers. The central portion comprises a first transition region extending between a first surface area of the first portion and the first central surface area. The first central surface area is recessed from the first major surface by a first distance. A thickness of the first transition region smoothly and monotonically decreases between the substrate thickness of the first portion and the central thickness of the central portion.

    FOLDABLE SUBSTRATES AND METHODS OF MAKING
    5.
    发明公开

    公开(公告)号:US20230309368A1

    公开(公告)日:2023-09-28

    申请号:US18023824

    申请日:2020-08-28

    CPC classification number: H10K77/111 H10K2102/311

    Abstract: Foldable substrates comprise a first outer layer comprising a first major surface, a second outer layer comprising a second major surface, and a core layer positioned therebetween. The core layer may comprise a first central surface area positioned between a first portion and a second portion of the first outer layer, and the core layer comprising a second central surface area positioned between a third portion and fourth portion of the second outer layer. Some foldable substrates comprise a first portion comprising a first depth of compression, a first depth of layer, and a first average concentration. The central portion may comprise a first central depth of compression, a first central depth of layer, and a central average concentration. Methods comprise chemically strengthening a foldable substrate. Some methods comprise etching the foldable substrate and then further chemically strengthening the foldable substrate.

    FOLDABLE APPARATUS, RIBBONS, AND METHODS OF MAKING

    公开(公告)号:US20220287195A1

    公开(公告)日:2022-09-08

    申请号:US17637929

    申请日:2020-08-28

    Abstract: Foldable apparatus can comprise a foldable substrate comprising a substrate thickness and a central portion positioned between a first portion and a second portion. The central portion can comprise a central thickness less than the substrate thickness. A first maximum tensile stress of a first tensile stress region in the first portion and a second maximum tensile stress of the second tensile stress region in the second portion can be less than a third maximum tensile stress of a central tensile stress region in the central portion. Ribbons can comprise a ribbon thickness and a central portion positioned between a first portion and a second portion. The central portion can comprise a first central compressive stress region and a second central compressive stress region. In some embodiments, methods of processing a ribbon can comprise masking the first portion, masking the second portion, and chemically strengthening the central portion.

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