公开(公告)号：US20190284683A1

公开(公告)日：2019-09-19

申请号：US16335383

申请日：2017-09-20

Applicant: CORNING INCORPORATED

Inventor： Xu Ouyang ,  Ye Guang Pan

IPC: C23C14/50 ,  C23C14/34 ,  H01J37/32 ,  H01J37/34

Abstract: An apparatus designed to sputter a material onto a plurality of substrates includes a rotating metal frame, a plurality of carriers, and an insulator disposed between the metal frame and the plurality of carriers. The plurality of carriers are designed to hold one or more fixtures that secure the plurality of substrates, and each of the plurality of carriers is designed to couple to the metal frame. The insulator is disposed between the metal frame and the plurality of carriers at locations where the plurality of carriers are coupled to the metal frame such that the plurality of carriers are electrically isolated from the metal frame.

公开(公告)号：US20190382883A1

公开(公告)日：2019-12-19

申请号：US16485696

申请日：2018-02-07

Applicant: Corning Incorporated

Inventor： Xu Ouyang ,  Ye Guang Pan

IPC: C23C14/50 ,  C23C14/35 ,  C23C14/58 ,  C03C17/00 ,  H01J37/34 ,  H01J37/32 ,  H05K5/03 ,  H05K5/00

Abstract: A sputtering device and method including a chamber, a target disposed within the chamber, and a substrate support including at least a portion consisting essentially of a non-aluminous and non-magnetic metallic material disposed within the chamber. The substrate support may include a carrier and a fixture for holding a substrate. In some embodiments, at least the target-facing surface of the carrier consists essentially of a non-aluminous and non-magnetic metallic material. In some embodiments, the fixture consists essentially of a non-aluminous and non-magnetic metallic material. The sputtering device may be drum sputtering device. The sputtering method may be a magnetron sputtering method.