公开(公告)号：US20200375024A1

公开(公告)日：2020-11-26

申请号：US16882146

申请日：2020-05-22

Applicant: CRAY INC.

Inventor： HYUNJUN KIM ,  Andrew J. Becker ,  Paul Taylor Wildes

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K1/18 ,  H05K1/14

Abstract: Systems and methods are provided for reducing crosstalk between differential signals in a printed circuit board (PCB) using fine pitch vias. A pair of contact pads are on the top surface of the PCB and configured to couple a PCB component to the PCB, the contacts a first distance from each other. A first via of a plurality of vias is electrically coupled to a first contact of the pair of contacts and a second via is electrically coupled to a second contact, the first via and second via a second distance from each other, the second distance being less than current standards for minimum via pitch. Each via comprises a via pad on the top surface and a plated through-hole extending from the top surface to a termination point. A separator gap is between the first via and the second via.