SYSTEM AND METHOD FOR DETECTION OF COUNTERFEIT AND CYBER ELECTRONIC COMPONENTS

    公开(公告)号:US20240370590A1

    公开(公告)日:2024-11-07

    申请号:US18772337

    申请日:2024-07-15

    Applicant: CYBORD LTD.

    Abstract: A method for detection of counterfeit and cyber electronic components, comprising: obtaining one or more features from a plurality of electronic components of a first type and from a plurality of electronic components of a second type: processing the one or more features to create a unique model related to an electronic component of the first type and to an electronic component of the second type; examining a detected electronic component by obtaining one or more features of the detected electronic component; executing the unique model with the one or more features of the detected electronic component; determining if the detected electronic component is an authentic electronic component of the first type or the second type; and evaluating the state of the detected electronic component's soldering pads, thereby enabling to detect reworking of a soldering pad of the detected electronic component as an indication of counterfeiting and to evaluate the quality of the pad for solderability.

    HIGH RESOLUTION TRACEABILITY
    3.
    发明申请

    公开(公告)号:US20250148583A1

    公开(公告)日:2025-05-08

    申请号:US18862538

    申请日:2023-05-04

    Applicant: CYBORD LTD.

    Abstract: A system for monitoring for an electronic circuit production line, the system comprising: at least one imaging system operable to acquire an image of a packaging unit (PU) label labeling a PU in which an electronic component that the production line includes in an electronic circuit is packaged by a supplier for delivery to an enterprise that operates the production line, and during production of the circuit at least one image of the component; and a processing and data hub having software configured to process the images to: determine a PU data record having logistical data fields comprising logistical data characterizing the PU and the component packaged in the PU; determine an encapsulation data record having logistical data fields comprising logistical data characterizing an encapsulation package of the component; and store the PU and encapsulation data records in a memory.

Patent Agency Ranking