PEEL PLY FOR SURFACE PREPARATION AND BONDING METHOD USING THE SAME

    公开(公告)号:US20210283891A1

    公开(公告)日:2021-09-16

    申请号:US16347239

    申请日:2018-12-19

    Abstract: A method for surface preparation of a composite substrate prior to adhesive bonding. The surface preparation method includes applying a resin-containing peel ply onto a composite substrate, followed by co-curing. The resin-containing peel ply contains a non-removable textile carrier and a removable woven fabric embedded therein. After co-curing, the peel ply is removed from the composite substrate such that the removable woven fabric is removed but the non-removable textile carrier and a film of residual resin remain on the composite substrate, thereby creating a modified, bondable surface on the composite substrate. The composite substrate with the modified surface can be bonded to another composite substrate, whereby the textile carrier remains an integrated part of the final bonded structure.

    FLAME-RETARDANT EPOXY COMPOSITION AND METHOD OF USING THE SAME

    公开(公告)号:US20220081551A1

    公开(公告)日:2022-03-17

    申请号:US17414132

    申请日:2019-12-17

    Abstract: A low-density, halogen-free epoxy composition that is flame-resistant upon curing and is suitable for use as a potting compound. The epoxy composition includes: (a) an epoxy component; (b) at least one curative; (c) at least one latent curing accelerator; (d) a toughening component that includes nano-sized core shell rubber (CSR) particles having particle size of less than 1 micron; (e) a fire-retardant component that is halogen-free; and (f) hollow microspheres for reducing the density of the composition. The fire-retardant component includes a mixture of: (i) at least one polyphosphate; (ii) at least one metal borate; and (iii) at least one compound selected from alkaline earth metal hydroxides and aluminum hydroxides.

    BONDING OF COMPOSITE SUBSTRATES
    4.
    发明申请

    公开(公告)号:US20190263072A1

    公开(公告)日:2019-08-29

    申请号:US16331299

    申请日:2017-09-08

    Abstract: A method for bonding composite substrates is disclosed. A curable surface treatment layer is applied onto a curable composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a peel ply composed of resin-impregnated fabric. If a peel ply is used, the peel ply is peeled off after co-curing, leaving behind a remaining thin film of partially cured resin. A subsequent dry physical surface treatment, such as plasma, is carried out to physically modify the surface of the surface treatment layer. After dry physical surface treatment, the composite substrate is provided with a chemically-active, bondable surface, which is adhesively bonded to another composite substrate to form a covalently-bonded structure.

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